230
Upgrade and Maintenance Manual
BX924
S3
Processors
9.6
Applying thermal paste
I
– For the Japanese market, the service engineer must follow the
instruction provided separately.
– If the processor upgrade or replacement kit contains a new CPU heat
sink, a thin layer of thermal compound has already been pre-applied
to its lower surface. In this case, please proceed with section
"Installing processor heat sinks" on page 219
.
Figure 98: Thermal paste syringe
One thermal compound syringe (FSP:P304000003) contains thermal paste for
two processors.
Field Replaceable Units (FRU)
Average task duration: 5 minutes
Summary of Contents for PRIMERGY BX924 S3
Page 6: ...Upgrade and Maintenance Manual BX924 S3 ...
Page 16: ...16 Upgrade and Maintenance Manual BX924 S3 ...
Page 20: ...20 Upgrade and Maintenance Manual BX924 S3 Introduction ...
Page 42: ...42 Upgrade and Maintenance Manual BX924 S3 Important information ...
Page 68: ...68 Upgrade and Maintenance Manual BX924 S3 Basic hardware procedures ...
Page 104: ...104 Upgrade and Maintenance Manual BX924 S3 Basic software procedures ...
Page 180: ...180 Upgrade and Maintenance Manual BX924 S3 Main memory ...
Page 232: ...232 Upgrade and Maintenance Manual BX924 S3 Processors ...
Page 278: ...278 Upgrade and Maintenance Manual BX924 S3 System board components ...