Strasbaugh 6DS-SP, Руководство по эксплуатации

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STRASBAUGH, INC.
June 5, 1998 6DS-SP Software Ver 4.26.1 Page 6
The following is a description of operator steps for the AGV > Polish > Scrubber auto
cycle:
1) Operator makes sure the 6DS-SP is idle, in screen idle, in wet idle, or already started
in an automatic cycle.
2) If AGV is the recipe source (Machine Setup menu), operator makes sure that the
"Auto Cycle Operation" and "Active Spindles" choices currently showing match what
is expected in AGV recipes.
3) Operator starts AGV and presses the remote 6DS-SP start button (or the start button
on the 6DS-SP).
4) AGV turns on transfer request (6DS-SP will ignore if busy in maintenance, etc.)
5) 6DS-SP automatically starts the "auto cycle" mode (if not already in an auto cycle).
6) If a 6DS-SP "start" alarm occurs, the 6DS-SP quits the cycle and returns to idle. As
long as the alarm condition exists, steps 5 and 6 will be performed indefinitely until
the 6DS-SP is aborted.
7) 6DS-SP attempts to receive wafer from AGV interface. If received, a "wafer present"
flag is set. If the "wafer set" signal is not seen in 30 seconds, a 6DS-SP alarm shows.
Note: The 6DS-SP will wait 240 seconds for a transfer request. If there is no transfer
request, the 6DS-SP will wait indefinitlely and show an alarm. If the transfer request
occurs, the alarm will clear and the transfer cycle will continue.
8) If using AGV supplied recipes and the wafer is not the second wafer of a pair,
the 6DS-SP attempts to load recipe. If the recipe is found - the cycle continues. If not
found - an alarm shows that can only be aborted. If receiving the second wafer of a
pair for dual polishing, the recipe ID is ignored and the first wafer's recipe is used for
both.
9) 6DS-SP moves wafer to load station.
When removed from the AGV station, the "wafer present" flag is cleared. Another
wafer can be immediately received from the AGV interface if it is the second of a pair
of wafers for dual spindle polishing. Otherwise, the 6DS-SP will not respond with
"ready" until the existing wafers are polished and returned to the load stations. This
provides maximum protection for the wafer by leaving it in the AGV unit until it is
actually needed.
(Operator steps continued on next page)