Strasbaugh 6DS-SP, Руководство по эксплуатации

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STRASBAUGH, INC.
January 24, 2001 6DS-SP Software Ver 4.36 Page 3
Strasbaugh Confidential Information
Support for Single Table Configuration with HydroLift:
Version 4.36 adds support for a single table 6DS-SP configuration with dedicated cleaning
stations and a HydroLift load station. With HydroLift load stations, the original dedicated
cleaning stations are no longer used for post polish wafer and carrier cleaning sequences.
Instead, the load station is used. The cleaning stations will still be used for loading and
unloading carriers.
The Conditioning/Cleaning menu, page 2, will now show the choices for using load stations as
cleaning stations instead of choices for dedicated cleaning stations.
Choice for No HydroLift Spray During Wafer Unloading:
Version 4.36 adds a choice to turn off the HydroLift load station's strong lifting spray during
wafer unloading. Typically, this spray is used for both wafer loading and wafer rinsing.
However, depending on application (such as small light wafers) the spray may lift the wafer
back onto the spindle during rinsing. The spray can also float the wafer out of position before
the robot can retrieve it. This new choice makes sure that outputs 37 and 38 (carrier pad
spray outputs that utilize the HydroLift spray) are off at these times.
Calibration variable 238 "No HydroLift w/unload(0-n,1-y)" sets this choice.
Set to "0" and the HydroLift spray will be on when wafers are unloaded from the spindles and
for a short time after the spindles raise.
Set to "1" and the HydroLift spray will be off during wafer unloading from the spindles.
Note: If fountain rinsing is enabled in Machine Parameters pages 3, even if the fountain
rinse time on page 2 is set to zero, the HydroLift spray will be on during the rinse
sequence. This is because outputs 70 and 71 are turned on at the start of the rinse
sequence if fountain rinsing is enabled.
Throughput Improvement if Using Primary Table In-Situ Conditioning:
Version 4.36 makes a change to the sequence after primary table polishing ends when using
in-situ conditioning. Previously, after the arm was moved to the in-situ outer position, the
sequence to raise the spindles waited for the arm to be up. Now, the spindle raising sequence
will not wait for the arm to raise. Also, the arm is now checked to make sure it reached the
up position at a later place in the automatic cycle.
For machines with lever-type arms, the benefit of this change will increase in proportion to the
length of the ramp time to raise the conditioning arm. For machines with lift-type arms, the
benefit will be small because lift-type arms raise quickly.