Strasbaugh 6DS-SP, Руководство по эксплуатации

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STRASBAUGH, INC.
July 6, 1998 6DS-SP Software Ver 4.27 Page 4
AGV Automatic Start and New Transfer Request Wait Variable:
Version 4.27 adds automatic starting for the AGV equipped machine configuration.
The 6DS-SP will automatically start when all of the following occur:
- The Machine Setup menu Wafer Source choice is set to "AGV Intrfc"
- Either the Auto Polish or Polish Parameters menu is showing
(the same menus required to start with the "start" pushbutton)
- The AGV sender asserts a transfer request
Note that these conditions do not have to occur in any particular order.
They must only exist simultaneously. For example:
If the wafer source is set to "AGV Intrfc" and the Auto Polish menu is showing, the 6DS-
SP will start when the AGV sender asserts a transfer request.
If the wafer source is set to "AGV Intrfc" and the AGV sender is already asserting a
transfer request but neither the Auto Polish nor Polish Parameter menu is showing, the
6DS-SP won't start. However, if either the Auto Polish or Polish Parameter menu is
selected, all conditions exist and the 6DS-SP will start. While it will appear as if menu
selection alone caused the start, it was actually the existance of three conditions.
Also, version 4.27 adds Calibration variable 101 "AGV max xfer req wait (secs)" instead of
the original fixed value set at 120 seconds in 4.26 and 240 seconds in 4.26.1.
Wafer Slipout Detection Change:
Version 4.27 changes the time when wafer slipout monitoring starts in an automatic cycle.
This change supports new spindle mounted sensors as well as earlier bridge mounted sensors.
Wafer slipout detection will now start 0.5 seconds after the spindle(s) reaches the down
switch(s). This insures that spindle mounted sensors are fully lowered before being
monitored for a slipout. (Reference for technicians: The 0.5 second time is set in Flopro
timer #47.)
Previously, detection could start when the spindles left the up switches. With the spindles
not yet down, spindle mounted slipout sensors would give false alarms.
ViPRR Default Pressure Change:
Version 4.27 changes the retaining ring default pressure after polishing. After polishing,
ViPRR pressure is now set to zero instead of a nominal 2 psi. This helps insure that the
wafer is not pushed off the carrier. However, retaining ring pressure is set to 2 psi after wafer
unloading to extend the ring for proper loading of the next wafers.
Spindle Lifting Cylinder Support: