Chapter 1: Introduction
implemented in order to receive temperature/voltage readings and
module presence signals. This board contains no user-serviceable
components.
WARNING!
A physical contact with the backplane may cause a fatal damage
to the RAID subsystem. For example, short-circuiting may occur if
you accidentally touch the backplane with a screwdriver.
1.2.4 Physical
Dimensions
The S12F subsystem comes in an enhanced 2U chassis with the
following dimensions:
Model
Without Forearm
Handles
With Forearm
Handles
S12F-R1432
88 x 446 x 498 mm
(H x W x D)
88 x 482 x 516 mm
(H x W x D)
S12F-G1433
88 x 446 x 490 mm
(H x W x D)
88 x 482 x 505 mm
(H x W x D)
1.3 Major
Components
Both S12F models house many active components and most of them
can be accessed through either the front or rear panel. The modular
enclosure design facilitates their easy installation and maintenance.
Hot-swap mechanisms are incorporated to eliminate power surges
and signal glitches that might occur while you remove or install these
modules. Each component is further described below:
1.3.1
LCD Keypad Panel
Figure 1-5: LCD Keypad Panel
The LCD panel (as shown above) consists of a 16 characters x 2
rows LCD screen with push buttons, a mute button, and LED status
1-5
