EonStor S12F-R1432/G1433 Installation and Hardware Reference Manual
About the dual-redundant RAID controllers in S12F-
R1432:
There is a Primary-Secondary relationship between the dual-
redundant RAID controllers. The upper RAID controller is
identified as
Controller A
while the lower controller is identified
as
Controller B.
By factory default,
Controller A
is the primary
controller and
Controller B
the secondary controller.
In normal operation, all array configuration and monitoring
functionality are managed by
Controller A
. However, to prevent
loss of access by a cabling or controller failure, connect the
serial ports on both controllers to a terminal console using the
included Y-cable and connect both Ethernet ports to your local
network.
If
Controller A
fails for any reason (hardware error, software
error, removal from system, etc.), then
Controller B
will take
over and become the primary controller.
If the failed
Controller A
restarts or a replacement is installed,
Controller A
will temporarily assume the role of the secondary
controller.
When the subsystem is rebooted, all system configurations
revert to the default state and
Controller B
returns the primary
role to
Controller A
.
․
BBUs:
Two (2) BBUs come as the default components for the
dual-controller S12F-R1432. For the S12F-G1433, BBU is an
optional item. When power outage occurs, BBU can protect the
data cached in memory. If its one-year life expectancy is
reached, system administrators will be notified by event
messages. BBU is independently accessible and hot-
replaceable. (See
Section 1.3.5.
)
․
PSUs:
Two (2) hot-swappable PSUs provide power to the
subsystem. A power switch is located on each PSU. (See
Section 1.3.6
)
․
Cooling Modules:
In S12F-R1432, two (2) redundant cooling
modules housed in the PSU modules ventilate the system with
an airflow directed from the front to the rear. In S12F-G1433,
three (3) redundant cooling modules are responsible for the
same ventilation job. (See
Section 1.3.7.
)
1.2.3 Internal
Backplane
An integrated backplane board separates the front and rear sections
of the chassis. This circuit board provides logic level signals and low
voltage power paths. Thermal sensors and I
2
C serial paths are
1-4
