User’s Manual U13850EJ6V0UD
637
CHAPTER 22 RECOMMENDED SOLDERING CONDITIONS
The V850/SB1 and V850/SB2 should be soldered and mounted under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document
Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
Table 22-1. Surface Mounting Type Soldering Conditions (1/5)
(1)
µµµµ
PD703031AGC-xxx-8EU:
100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703031BGC-xxx-8EU:
100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703031AYGC-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703031BYGC-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703033AGC-xxx-8EU:
100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703033BGC-xxx-8EU:
100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703033AYGC-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703033BYGC-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703034AGC-xxx-8EU:
100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703034BGC-xxx-8EU:
100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703034AYGC-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703034BYGC-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703035AGC-xxx-8EU:
100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703035BGC-xxx-8EU:
100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703035AYGC-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14
××××
14)
µµµµ
PD703035BYGC-xxx-8EU: 100-pin plastic LQFP (fine pitch) (14
××××
14)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 10 to 72 hours)
IR35-107-2
VPS
Package peak temperature: 215°C, Time: 25 to 40 seconds (at 200°C or higher),
Count: Two times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 10 to 72 hours)
VP15-107-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
Содержание V850/SB1
Страница 2: ...User s Manual U13850EJ6V0UD 2 MEMO ...