CHAPTER 22 RECOMMENDED SOLDERING CONDITIONS
User’s Manual U13850EJ6V0UD
640
Table 22-1. Surface Mounting Type Soldering Conditions (4/5)
(4)
µµµµ
PD70F3030BGF-3BA:
100-pin plastic QFP (14
××××
20)
µµµµ
PD70F3030BYGF-3BA: 100-pin plastic QFP (14
××××
20)
µµµµ
PD70F3032AGF-3BA:
100-pin plastic QFP (14
××××
20)
µµµµ
PD70F3032BGF-3BA:
100-pin plastic QFP (14
××××
20)
µµµµ
PD70F3032AYGF-3BA: 100-pin plastic QFP (14
××××
20)
µµµµ
PD70F3032BYGF-3BA: 100-pin plastic QFP (14
××××
20)
µµµµ
PD70F3036HGF-3BA:
100-pin plastic QFP (14
××××
20)
µµµµ
PD70F3036HYGF-3BA: 100-pin plastic QFP (14
××××
20)
µµµµ
PD70F3037AGF-3BA:
100-pin plastic QFP (14
××××
20)
µµµµ
PD70F3037HGF-3BA:
100-pin plastic QFP (14
××××
20)
µµµµ
PD70F3037AYGF-3BA: 100-pin plastic QFP (14
××××
20)
µµµµ
PD70F3037HYGF-3BA: 100-pin plastic QFP (14
××××
20)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125°C for 20 to 72 hours)
IR35-203-2
VPS
Package peak temperature: 215°C, Time: 25 to 40 seconds (at 200°C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125°C for 20 to 72 hours)
VP15-203-2
Wave soldering
Solder bath temperature: 260°C max., Time: 10 seconds max., Count: once
Preheating temperature: 120°C max. (package surface temperature)
Exposure limit: 3 days
Note
(after that, prebake at 125°C for 20 to 72 hours)
WS60-203-1
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
Содержание V850/SB1
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