CHAPTER 22 RECOMMENDED SOLDERING CONDITIONS
User’s Manual U13850EJ6V0UD
641
Table 22-1. Surface Mounting Type Soldering Conditions (5/5)
(5)
µ
PD70F3030BGC-8EU:
100-pin plastic LQFP (fine pitch) (14
××××
14)
µ
PD70F3030BYGC-8EU: 100-pin plastic LQFP (fine pitch) (14
××××
14)
µ
PD70F3036HGC-8EU:
100-pin plastic LQFP (fine pitch) (14
××××
14)
µ
PD70F3036HYGC-8EU: 100-pin plastic LQFP (fine pitch) (14
××××
14)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 230°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125°C for 10 hours)
IR30-103-2
VPS
Package peak temperature: 215°C, Time: 25 to 40 seconds (at 200°C or higher),
Count: Two times or less
Exposure limit: 3 days
Note
(after that, prebake at 125°C for 10 hours)
VP15-103-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution
Do not use different soldering methods together (except for partial heating).
Содержание V850/SB1
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