CHAPTER 18 RECOMMENDED SOLDERING CONDITIONS
663
User’s Manual U15195EJ5V0UD
(3)
µ
PD703114GC-
×××
-8EU-A:
100-pin plastic LQFP (fine pitch) (14
×
14)
µ
PD703114GC(A)-
×××
-8EU-A: 100-pin plastic LQFP (fine pitch) (14
×
14)
µ
PD70F3114GC-8EU-A: 100-pin
plastic LQFP (fine pitch) (14
×
14)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Three times or less
Exposure limit: 7 days
Note
(after that, prebake at 125°C for 20 to 72 hours)
IR60-207-3
Wave soldering
For details, consult an NEC Electronics sales representative.
–
Partial heating
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
–
(4)
µ
PD703114GF-
×××
-3BA-A:
100-pin plastic QFP (14
×
20)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Three times or less
Exposure limit: 3 days
Note
(after that, prebake at 125°C for 20 to 72 hours)
IR60-203-3
Wave soldering
For details, consult an NEC Electronics sales representative.
–
Partial heating
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
–
Note
After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remarks 1.
Products with -A at the end of the part number are lead-free products.
2.
For soldering methods and conditions other than those recommended above, consult an NEC
Electronics sales representative.
3.
For soldering conditions for the
µ
PD70F3114GC(A)-8EU-A and 70F3114GF-3BA-A, consult an NEC
Electronics sales representative.
Содержание PD703114
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