Rev. 3.0, 03/01, page 365 of 390
Section 21 Recommended Reflow Condition
248
222
196
170
144
118
92
66
53
106
159
212
Time (seconds)
1
2
3
4
6
5
265
318
371
424
477
Lead Temperature (˚C)
Lead Soldering Profile in the IR Oven
Limits for IR Reflow Profile Characteristics of Package Leads
Characteristics #
Characteristic Description
Limits
1
Initial Heating Rate of Leads
0.8-1.2
°
C / Sec.
2
Peak Lead Temperature in Preheat Zone
125
°
C±20
°
C
3
Time above 150
°
C
400 Secs Max
4
Time above 183
°
C
(63 / 37 Tin / Lead Paste Melting Point)
Max-150 sec.
5
Peak Reflow Lead Temperature
*
215 ±5
°
C
6
Cooling rate of lead
Max 4
°
C / Sec.
Note:
Devices classified as moisture sensitive should limit maximum body temperature to 220
°
C.
Содержание HD64465
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