32 BASIC EXTERNAL CONNECTION DIAGRAM
S1C33L26 TECHNICAL MANUAL
Seiko Epson Corporation
32-1
Basic External Connection Diagram
32
External
bus
A[25:21]
A20/#SDRAS
A19/#SDCAS
A18/#SDWE
A17/DQMH
A16/DQML
A[15:14]/SDBA[1:0]
A[13:1]/SDA[12:0]
A0/#BSL
D[15:0]
#RD
#WRL
#WRH/#BSH
#CEx
#WAIT
SDCKE
SDCLK
#SDCS
#NMI
CMU_CLK
WDT_CLK
#WDT_NMI
FPFRAME
FPLINE
FPDAT[23:0]
FPSHIFT
FPDRDY
TFT_CTL[3:0]
SINx
SOUTx
SCLKx
#SRDYx
USI_DI
USI_DO
USI_CK
USI_CS
USIL_DI
USIL_DO
USIL_CK
USIL_CS
LCD_D[7:0]
#NAND_RD
#NAND_WR
I2S_SDO
I2S_WS
I2S_SCLK
I2S_MCLK
#ADTRIG
AINx
PWM_EXCL
PWM_H
PWM_L
T16A_EXCL_x
T16A_ATMA_x
T16A_ATMB_x
REMC_I
REMC_O
Pxx
LCD panel
Card
(NAND Flash)
I
2
S
A/D input
16-bit PWM timer
(T16A5) input/output
I/O
Serial I/O
(UART, SPI, I
2
C)
Serial/parallel I/O
(UART, SPI, I
2
C,
LCD driver)
Serial I/O
(FSIO)
Remote transmitter/
receiver
16-bit audio PWM timer
(T16P) input/output
S1C33L26
[The potential of the substrate
(back of the chip) is V
SS
.]
LV
DD
RTCV
DD
PLLV
DD
HV
DD
AV
DD
MCLKI
MCLKO
RTCCLKI
RTCCLKO
#RESET
TEST
V
SS
PLLV
SS
WAKEUP
#STBY
*
VCP
DSIO
DPCO
DCLK
DST[2:0]
BOOT
Cres
1.8 V
3.3 V
C
P
+
+
C
G3
Rf
3
X'tal3 or
Ceramic
C
D3
C
G1
Rf
1
Rd
3
Rd
1
X'tal1
C
D1
Leave the pins open or
use as debug pins
Pull up or use
as a debug pin
10k
HV
DD
HV
DD
RTCV
DD
*
The #STBY pin should be fixed at the RTCV
DD
level if it is not used for power control.