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System Manual
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Deposition rate has dropped
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Non-uniform deposition
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Precursor source pot is empty
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Blockage in the delivery line. Follow H&S procedure
•
Showerhead plate is clogged
•
Chamber leak – Check leak-up rate
•
Faulty MFC – check partial pressures
•
Check MFCs / Pumps
•
RF generator/matching – adjust matching unit set-up, check generator range switch, watch HF
matching time in mixed frequency pulsed process
•
Incorrect gases used
•
Temperature – cooling or heater failure
•
Chamber is dirty – needs more frequent cleaning
•
Incorrect process regime (knife-edge process)
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Wrong process for given hardware - no pumpdown time, no preheat step, no pre-clean step
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Plasma does not ignite/light up
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Plasma is unstable/pulsing
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Plasma is flickering
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Check that readbacks are within tolerance – MFCs, pressure control, RF matching, temperature.
Check that base pressure has been reached (this can always be changed if you are in a hurry!)
Read error / warning / information messages
Check that plasma is striking
Try selecting ‘ignore tolerance’ checkbox
Sudden pressure rise – check for dissociation, - try Ar instead, strike at reduced ICP power
Process Information
(Information contained in this document is confidential)
Printed: 08 October 2007 11:00
Page 9 of 14
Issue 1: August 07
Содержание OpAL
Страница 14: ......
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