484
CHAPTER 28 RECOMMENDED SOLDERING CONDITIONS
User’s Manual U15798EJ2V0UD
Table 28-1. Surface Mounting Type Soldering Conditions (2/3)
(2)
µ
PD780343F1-
×××
-DA3: 113-pin plastic FBGA (10
×
10)
µ
PD780344F1-
×××
-DA3: 113-pin plastic FBGA (10
×
10)
µ
PD780353F1-
×××
-DA3: 113-pin plastic FBGA (10
×
10)
µ
PD780354F1-
×××
-DA3: 113-pin plastic FBGA (10
×
10)
µ
PD780343YF1-
×××
-DA3: 113-pin plastic FBGA (10
×
10)
µ
PD780344YF1-
×××
-DA3: 113-pin plastic FBGA (10
×
10)
µ
PD780353YF1-
×××
-DA3: 113-pin plastic FBGA (10
×
10)
µ
PD780354YF1-
×××
-DA3: 113-pin plastic FBGA (10
×
10)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max.
IR35-107-2
(at 210
°
C or higher), Count: Two times or less, Exposure limit:
7 days
Note
(after that, prebake at 125
°
C for 10 hours)
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max.
VP15-107-2
(at 200
°
C or higher), Count: Two times or less, Exposure limit:
7 days
Note
(after that, prebake at 125
°
C for 10 hours)
Wave soldering
Solder bath temperature: 260
°
C max., Time: 10 seconds max.,
WS60-107-1
Count: Once, Preheating temperature: 120
°
C Max. (package surface
temperature), Exposure limit: 7 days
Note
(after that, prebake at 125
°
C
for 10 hours)
Note
After opening the dry pack, store it at 25
°
C or less and 65%RH or less for the allowable storage period.
Caution Do not use different soldering methods together.
Содержание mPD780344 Series
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