485
CHAPTER 28 RECOMMENDED SOLDERING CONDITIONS
User’s Manual U15798EJ2V0UD
Table 28-1. Surface Mounting Type Soldering Conditions (3/3)
(3)
µ
PD78F0354F1-DA3: 113-pin plastic FBGA (10
×
10)
µ
PD78F0354YF1-DA3: 113-pin plastic FBGA (10
×
10)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°
C, Time: 30 seconds max.
IR35-107-2
(at 210
°
C or higher), Count: Two times or less, Exposure limit:
7 days
Note
(after that, prebake at 125
°
C for 10 hours)
VPS
Package peak temperature: 215
°
C, Time: 40 seconds max.
VP15-107-2
(at 200
°
C or higher), Count: Two times or less, Exposure limit:
7 days
Note
(after that, prebake at 125
°
C for 10 hours)
Note
After opening the dry pack, store it at 25
°
C or less and 65%RH or less for the allowable storage period.
Caution Do not use different soldering methods together.
Содержание mPD780344 Series
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