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CHAPTER 23
µ
PD78F0354, 78F0354Y
User’s Manual U15798EJ2V0UD
Table 23-1. Differences Between
µ
PD78F0354 and 78F0354Y, and Mask ROM Versions
Item
Flash Memory Versions
Mask ROM Versions
µ
PD78F0354
µ
PD78F0354Y
µ
PD780343,
µ
PD780353,
µ
PD780343Y,
µ
PD780353Y,
µ
PD780344
µ
PD780354
µ
PD780344Y
µ
PD780354Y
ROM structure
Flash memory
Mask ROM
ROM capacity
32 KB
Note
µ
PD780343, 780353, 780343Y, 780353Y: 24 KB
µ
PD780344, 780354, 780344Y, 780354Y: 32 KB
High-speed RAM capacity
1,024 bytes
Note
512 bytes
Expansion RAM capacity
512 bytes
RAM capacity for LCD
40
×
8 bits
display
Alternate function of pins P30
Not provided
Provided
Not provided
Provided
and P31
(SCL0, SDA0)
(SCL0, SDA0)
Pull-up resistors of pins P30 and Not provided
On-chip pull-up resistor can
Not provided
P31
be specified by mask option
in 1-bit units
Pull-up resistors of pins P70 to
Not provided
On-chip pull-up resistor can be specified by mask option in
P73
1-bit units
A/D converter resolution
10 bits
8 bits
10 bits
8 bits
10 bits
Serial interface IIC0
Not provided
Provided
Not provided
Provided
Restrictions in HALT mode when Refer to
Caution
in
20.2.1 (2)
None
×
4 multiplication subclock is used
HALT mode release
IC pin
Not provided
Provided
V
PP
pin
Provided
Not provided
Electrical specifications
Refer to
CHAPTER 25 ELECTRICAL SPECIFICATIONS
Note
The same capacity as the mask ROM versions can be specified by means of the memory size switching
register (IMS).
Caution There are differences in noise immunity and noise radiation between the flash memory and mask
ROM versions. When pre-producing an application set with the flash memory version and then
mass-producing it with the mask ROM version, be sure to conduct sufficient evaluations for the
commercial samples (not engineering samples) of the mask ROM version.
Internal memory
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