MD Helicopters 369-500, Maintenance Instructions Manual

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CSP-HMI-3
MD Helicopters, Inc
.
MAINTENANCE MANUAL
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The information disclosed herein is proprietary to MD Helicopters, Inc.
Neither this document nor any part hereof may be reproduced or transferred to
other documents or used or disclosed to others for manufacturing or any other
purpose except as specifically authorized in writing by MD Helicopters, Inc.
Copyright
©
1999 − 2016 by MD Helicopters, Inc.
E. Solder Joint Inspection
(Ref. Figure 605)
(1). Visually inspect solder joint using the
following criteria:
(a). Solder joint shall exhibit a bright,
metallic luster, smooth nonporous
surface texture, good adherence, and
filleting.
(b). Visible inclusions of foreign material,
indication of overheating, voids,
grainy areas, pin holes, craters,
cracks, fractures, solder spikes, cold
solder flow, poor wetting action,
excess flux residue, or excessive
solder buildup are not allowed.
(2). Visually inspect stranded wires using
the following criteria:
(a). Stranded wires shall be completely
wetted by solder, penetrating to inner
strands without obscuring wire
contour.
(b). Too much solder on strands which
results in wicking of wire insulation
is not allowed.
(c). Charred, burned, blackened wire
insulation or component is not
allowed.
(3). Visually inspect immediate area where
maintenance was performed for any
additional solder.
(a). Additional solder on component or
around solder joint in the form of a
thin film which does not interfere
with subsequent assembly or opera­
tion is acceptable.
(b). Solder splash or flash across assem­
bly circuitry is not allowed.
(4). Correct unacceptable conditions as
required (Ref. Wire Terminations).
G96-0036
SOLDER FROM
PRETINNG
SOLDER FILLET BETWEEN
COMPONENT AND WIRE
LEAD
GOOD WETTING
NO EXPOSED CONDUCTOR
180 DEG WIRE WRAP
(MINIMUM)
WITH NO OVERLAPPING
OF WIRE
WIRE CONDUCTOR
VISIBLE
WIRE LEAD
COMPONENT LEAD
SOLDER FILLET BETWEEN
WIRE AND CONTACT CUP
WIRE CONTOUR VISIBLE,
GOOD WETTING.
NO EXPOSED CONDUCTOR.
SOLDER FROM
PRETINNING
SOLDER FROM PRETINNING
SOLDER FILLET BETWEEN
TERMINAL AND WIRE / LEAD
180
°
WIRE WRAP (MINIMUM)
WITH NO OVERLAPPING OF WIRE
WIRE CONTOUR VISIBLE
GOOD WETTING
NO EXPOSED CONDUCTOR
WIRE TO COMPONENT LEAD SOLDER JOINT
SOLDER CUP JOINT
TERMINAL SOLDER JOINT
Figure 605. Solder Joint Acceptance Criteria