Working Instruction
,
Mechanical
3/00021-1/FEA 209 544/597 B
©
Sony Ericsson Mobile Communications AB
9(113)
Step-by-Step Instructions
3.
Once the main flex film is disconnected, lift up on
the flip assembly while pulling down on each side of
the inner base cover in the locations that are in line
with the screw bosses that protrude through the
board. The flip assembly, including the hinge and
the antenna cover should easily lift away from the
circuit board.
2.1.5
Circuit Board Removal
Tools needed to perform the following steps:
None
Step-by-Step Instructions
1.
Lift the circuit board from the inner base cover.