Working Instruction
,
Mechanical
3/00021-1/FEA 209 544/597 B
©
Sony Ericsson Mobile Communications AB
22(113)
3.1.3
LCD Sub-Frame Removal
The sections of the Flip Disassembly preceding this section must be performed in sequential order
before the disassembly steps listed below can be performed.
Tools needed to perform the following steps:
None
Step-by-Step Instructions
1.
Partial1y open the hinge by rotating the flip up from
the base about 30 degrees and then closing the flip
back down onto the base. This moves the hinge arm
up off of the LCD sub-frame.
2.
Lift the LCD sub-frame off of the phone.
NOTE! Be careful not to damage the flex circuit
when removing the LCD sub-frame.