Virtex-4 QV FPGA Ceramic Packaging
159
UG496 (v1.1) June 8, 2012
CF1509 (LX200) Ceramic Flip-Chip Column Grid Package
R
N/A
VCCINT
AD22
N/A
VCCINT
AK22
N/A
VCCINT
E23
N/A
VCCINT
L23
N/A
VCCINT
R23
N/A
VCCINT
U23
N/A
VCCINT
AA23
N/A
VCCINT
AC23
N/A
VCCINT
AN23
N/A
VCCINT
H24
N/A
VCCINT
P24
N/A
VCCINT
T24
N/A
VCCINT
AB24
N/A
VCCINT
AD24
N/A
VCCINT
AF24
N/A
VCCINT
AH24
N/A
VCCINT
L25
N/A
VCCINT
N25
N/A
VCCINT
R25
N/A
VCCINT
U25
N/A
VCCINT
W25
N/A
VCCINT
AA25
N/A
VCCINT
AC25
N/A
VCCINT
AG25
N/A
VCCINT
AJ25
N/A
VCCINT
K26
N/A
VCCINT
M26
N/A
VCCINT
P26
N/A
VCCINT
T26
N/A
VCCINT
Y26
N/A
VCCINT
AB26
N/A
VCCINT
AF26
N/A
VCCINT
AH26
N/A
VCCINT
AK26
N/A
VCCINT
AM26
N/A
VCCINT
G27
N/A
VCCINT
N27
N/A
VCCINT
R27
Table 2-4:
CF1509 Package Pinout (LX200) (Cont’d)
Bank
Pin Description
Pin Number
No Connect