Xilinx Virtex-4 QV FPGA, Руководство пользователя

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Virtex-4 QV FPGA Ceramic Packaging www.xilinx.com 175
UG496 (v1.1) June 8, 2012
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Chapter 5
Thermal Specifications
This chapter provides thermal data associated with Virtex-4 QV Radiation Hardened
FPGA packaging. The following topics are discussed:
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“Introduction”
•
“Thermal Resistance and Package Mass”
Introduction
Ceramic flip-chip column grid array (CF) packages are surface-mount-compatible
packages using high-temperature solder columns as interconnections to the board.
Compared to the solder spheres, the columns have lower stiffness and provide a higher
stand-off. These features significantly increase the reliability of the solder joints. When
combined with a high-density, multi-layer ceramic substrate, this packaging technology
offers a high-density, reliable packaging solution.
CF Package Construction and Key Features
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IBM technology
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Qualified per MIL-Std 883
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Non-hermetic multi-layer ceramic substrate
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High planarity and excellent thermal stability at high temperature
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CTE matches well with the silicon die
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Low corrosion sensitivity
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Meets JEDEC MSL-1
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Meets NASA outgas requirements
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90Pb/10Sn solid copper core columns
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90Pb/10Sn die solder bumps
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Silicon carbide heat-spreader