Virtex-4 QV FPGA Ceramic Packaging
155
UG496 (v1.1) June 8, 2012
CF1509 (LX200) Ceramic Flip-Chip Column Grid Package
R
N/A
GND
V31
N/A
GND
AH31
N/A
GND
AV31
N/A
GND
A32
N/A
GND
L32
N/A
GND
AA32
N/A
GND
AL32
N/A
GND
D33
N/A
GND
P33
N/A
GND
AD33
N/A
GND
AP33
N/A
GND
G34
N/A
GND
U34
N/A
GND
AG34
N/A
GND
AU34
N/A
GND
K35
N/A
GND
Y35
N/A
GND
AK35
N/A
GND
C36
N/A
GND
N36
N/A
GND
AC36
N/A
GND
AN36
N/A
GND
F37
N/A
GND
T37
N/A
GND
AF37
N/A
GND
AT37
N/A
GND
A38
NC
N/A
GND
AV38
N/A
GND
B38
N/A
GND
J38
N/A
GND
W38
N/A
GND
AJ38
N/A
GND
AW38
NC
N/A
GND
B39
NC
N/A
GND
M39
N/A
GND
AB39
N/A
GND
AM39
N/A
GND
AV39
NC
Table 2-4:
CF1509 Package Pinout (LX200) (Cont’d)
Bank
Pin Description
Pin Number
No Connect