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Device Description
WAGO-I/O-SYSTEM 750
753-668/000-004 4FAI 0/4-20 mA Diff PROFIsafe
Manual
Version 1.0.0, valid from HW/SW Version 01/01
3.8.1
Transport and Storage Conditions
During transport and storage, the F I/O modules must be protected against
undue stress such as mechanical loads, temperature, humidity and aggressive
atmospheres.
The F I/O modules should be stored in the original packaging when possible,
which offers optimal protection during transport.
When picking or unpacking, do not contaminate or damage the contacts. The
F I/O modules must be stored and transported in suitable containers/packaging in
compliance with the ESD instructions. The devices contain components sensitive
to static discharge and can be damaged by improper handling.
Therefore, when transporting open modules, use statically shielded transport
bags with metal coating to prevent contamination from amines, amides and
silicones such as 3M 1900E.
In addition, take the required protective measures against electrostatic discharge
(ESD) during commissioning and maintenance of the F I/O modules.
Ensure that the environment is well grounded!
The devices are equipped with electronic components that may be destroyed by
electrostatic discharge. When handling the devices, ensure that the environment
(persons, workplace and packing) is well grounded. Avoid touching conductive
components, e.g. data contacts.