Intel Celeron Dual-Core E1000 Series, Руководство по дизайну

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6 Thermal and Mechanical Design Guidelines
Figures
Figure 2-1. Package IHS Load Areas ..................................................................15
Figure 2-2. Processor Case Temperature Measurement Location ............................19
Figure 2-3. Example Thermal Profile ..................................................................20
Figure 3-1. Processor Thermal Characterization Parameter Relationships.................28
Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX
Heatsink .......................................................................................31
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink ...31
Figure 4-1. Thermal Monitor Control ..................................................................35
Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering .............................36
Figure 4-3. TCONTROL for Digital Thermal Sensor................................................39
Figure 5-1. Effective TMA Fan Curves with Reference Extrusion..............................45
Figure 5-2. Random Vibration PSD ....................................................................47
Figure 5-3. Shock Acceleration Curve.................................................................48
Figure 5-4. Intel Type II TMA 65W Reference Design............................................50
Figure 5-5. Upward Board Deflection During Shock ..............................................51
Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly
Stiffness .......................................................................................52
Figure 5-7. Thermal Module Attach Pointes and Duct-to-SRM Interface Features ......53
Figure 6-1. D60188-001Reference Design – Exploded View ...................................56
Figure 6-2. E18764-001 Reference Design – Exploded View ..................................57
Figure 6-3. Bottom View of Copper Core Applied by TC-1996 Grease ......................57
Figure 6-4. Random Vibration PSD ....................................................................61
Figure 6-5. Shock Acceleration Curve.................................................................62
Figure 6-6. Upward Board Deflection During Shock ..............................................65
Figure 6-7. Reference Clip/Heatsink Assembly.....................................................66
Figure 6-8. Critical Parameters for Interfacing to Reference Clip.............................67
Figure 6-9. Critical Core Dimension ...................................................................67
Figure 7-1. Intel
®
QST Overview .......................................................................70
Figure 7-2. PID Controller Fundamentals ............................................................71
Figure 7-3. Intel
®
QST Platform Requirements ....................................................72
Figure 7-4. Example Acoustic Fan Speed Control Implementation...........................73
Figure 7-5. Digital Thermal Sensor and Thermistor ..............................................74
Figure 7-6. Board Deflection Definition...............................................................77
Figure 7-7. Example: Defining Heatsink Preload Meeting Board Deflection Limit .......79
Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket – Bottom View ..82
Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket – Side View ......83
Figure 7-10. Preload Test Configuration..............................................................83
Figure 7-11. Omega Thermocouple....................................................................90
Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o’clock Exit .....92
Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 o’clock Exit
(Old Drawing)..............................................................................93
Figure 7-14. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package ................94
Figure 7-15. IHS Groove at 6 o’clock Exit Orientation Relative to the LGA775
Socket ........................................................................................94
Figure 7-16. Inspection of Insulation on Thermocouple.........................................95
Figure 7-17. Bending the Tip of the Thermocouple ...............................................96
Figure 7-18. Securing Thermocouple Wires with Kapton* Tape Prior to Attach .........96
Figure 7-19. Thermocouple Bead Placement........................................................97
Figure 7-20. Position Bead on the Groove Step....................................................98