Legacy Fan Speed Control
116
Thermal and Mechanical Design Guidelines
To use all of the features in the Intel reference heatsink design or the Boxed
Processor, system integrators should verify the following functionality is present in the
board design. Please refer to the Fan Specification for 4 wire PWM Controlled Fans and
Chapter
6 for complete details on the Intel enabled thermal solution.
The basics of Fan Speed Control were discussed in Chapter
7, as a review the FSC
definitions are listed in Table
Table
7-3. FSC Definitions
Item Definition
T
SENSOR
Temperature reported from the processor on-die thermal sensor.
T
CONTROL
T
CONTROL
is the specification limit for use with the on-die thermal sensor.
Thermal
Diode Offset
Thermal Diode Offset
is the MSR value programmed into the processor with
the on-
die thermal diode
to account for perceived diode ideality shift.
Thermal
Diode Base
The constant published in the processor datasheet for calculating Thermal
Diode Correction Factor.
Thermal
Diode
Correction
Factor
Thermal Diode Correction Factor is the sum of the Thermal Diode Offset and
Thermal Diode Base. This value is used to compensate for temperature errors
if the diode ideality factor is near the maximum or minimum values. It is only
used for HW Monitor components that measure the on-die thermal diode using
the diode model.
T
LOW
The temperature above which the fan will begin to accelerate in response to
the on-die thermal sensor temperature.
Hysteresis
The number of degrees below T
CONTROL
the fans will remain on before slowing
down.
T
HIGH
The temperature at which the fan is operating at full speed (100% PWM Duty
Cycle). By specification this is T
CONTROL
.
All Fans ON
The processor temperature at which all fans in the system are increased to
100% Duty Cycle.
Min PWM
Minimum pulse width modulation (% duty cycle) that the fans will run at when
T
SENSOR
is less than T
LOW
.
Spin-up
Amount of time fan is run at 100% duty cycle to overcome fan inertia.
PWM Freq
The operating frequency of the PWM signal.
T
AVERAGING
The time (in seconds) that elapses while the fan is gradually sped up in
response to a processor temperature spike.
Содержание Celeron Dual-Core E1000 Series
Страница 10: ...10 Thermal and Mechanical Design Guidelines...
Страница 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...
Страница 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...
Страница 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...
Страница 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...
Страница 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...
Страница 124: ...Balanced Technology Extended BTX System Thermal Considerations 124 Thermal and Mechanical Design Guidelines...
Страница 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...
Страница 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...
Страница 139: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 139 Figure 7 57 Reference Fastener Sheet 1...
Страница 140: ...Mechanical Drawings 140 Thermal and Mechanical Design Guidelines Figure 7 58 Reference Fastener Sheet 2...
Страница 141: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 141 Figure 7 59 Reference Fastener Sheet 3...
Страница 142: ...Mechanical Drawings 142 Thermal and Mechanical Design Guidelines Figure 7 60 Reference Fastener Sheet 4...
