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Balanced Technology Extended (BTX) Thermal/Mechanical Design Information

Thermal and Mechanical Design Guidelines

5.2.2

Power Cycling

Thermal performance degradation due to TIM degradation is evaluated using power

cycling testing. The test is defined by 7500 cycles for the case temperature from room

temperature (~23 ºC) to the maximum case temperature defined by the thermal

profile at TDP.

5.2.3

Recommended BIOS/CPU/Memory Test Procedures

This test is to ensure proper operation of the product before and after environmental

stresses, with the thermal mechanical enabling components assembled. The test shall

be conducted on a fully operational motherboard that has not been exposed to any

battery of tests prior to the test being considered.

Testing setup should include the following components, properly assembled and/or

connected:

•

Appropriate system motherboard

•

Processor

•

All enabling components, including socket and thermal solution parts

•

Power supply

•

Disk drive

•

Video card

•

DIMM

•

Keyboard

•

Monitor

The pass criterion is that the system under test shall successfully complete the

checking of BIOS, basic processor functions and memory, without any errors.

5.3

Material and Recycling Requirements

Material shall be resistant to fungal growth. Examples of non-resistant materials

include cellulose materials, animal and vegetable based adhesives, grease, oils, and

many hydrocarbons. Synthetic materials such as PVC formulations, certain

polyurethane compositions (e.g., polyester and some polyethers), plastics which

contain organic fillers of laminating materials, paints, and varnishes also are

susceptible to fungal growth. If materials are not fungal growth resistant, then MIL-

STD-810E, Method 508.4 must be performed to determine material performance.

Material used shall not have deformation or degradation in a temperature life test.

Any plastic component exceeding 25 grams must be recyclable per the European Blue

Angel recycling standards.

Содержание Celeron Dual-Core E1000 Series

Страница 1: ...al Core Processor and Intel Celeron Dual Core Processor Thermal and Mechanical Design Guidelines Supporting the Intel Core 2 Duo Processor E6000 and E4000 Series Intel Pentium Dual Core Processor E200...

Страница 2: ...from future changes to them The hardware vendor remains solely responsible for the design sale and functionality of its product including any liability arising from product infringement or product wa...

Страница 3: ...ions 24 2 4 1 Chassis Thermal Design Capabilities 24 2 4 2 Improving Chassis Thermal Performance 24 2 4 3 Summary 25 2 5 System Integration Considerations 25 3 Thermal Metrology 27 3 1 Characterizing...

Страница 4: ...Information 55 6 1 ATX Reference Design Requirements 55 6 2 Validation Results for Reference Design 58 6 2 1 Heatsink Performance 58 6 2 2 Acoustics 59 6 2 3 Altitude 60 6 2 4 Heatsink Thermal Validat...

Страница 5: ...Metrology 89 D 1 Objective and Scope 89 D 2 Supporting Test Equipment 89 D 3 Thermal Calibration and Controls 91 D 4 IHS Groove 91 D 5 Thermocouple Attach Procedure 95 D 5 1 Thermocouple Conditioning...

Страница 6: ...eration Curve 62 Figure 6 6 Upward Board Deflection During Shock 65 Figure 6 7 Reference Clip Heatsink Assembly 66 Figure 6 8 Critical Parameters for Interfacing to Reference Clip 67 Figure 6 9 Critic...

Страница 7: ...re 7 44 FSC Definition Example 117 Figure 7 45 System Airflow Illustration with System Monitor Point Area Identified 122 Figure 7 46 Thermal sensor Location Illustration 123 Figure 7 47 ATX ATX Mother...

Страница 8: ...3 Acoustic Results for ATX Reference Heatsink D60188 001 59 Table 6 4 Acoustic Results for ATX Reference Heatsink E18764 001 59 Table 7 1 Board Deflection Configuration Definitions 76 Table 7 2 Typic...

Страница 9: ...2 Duo Desktop processor E4600 October 2007 006 Added Intel Pentium Dual Core processor E2200 specifications December 2007 007 Added Intel Celeron Dual Core processor E1000 series Updated reference des...

Страница 10: ...10 Thermal and Mechanical Design Guidelines...

Страница 11: ...solution All of these parameters are affected by the continued push of technology to increase processor performance levels and packaging density more transistors As operating frequencies increase and...

Страница 12: ...will be listed In this document when a reference is made to the the reference design it is intended that this includes all ATX reference designs D60188 001 and E18764 001 supported by this document I...

Страница 13: ...ATX Thermal Design Suggestions http www formfactors org Balanced Technology Extended BTX System Design Guide http www formfactors org Thermally Advantaged Chassis version 1 1 http www intel com go cha...

Страница 14: ...Land LGA package ACPI Advanced Configuration and Power Interface Bypass Bypass is the area between a passive heatsink and any object that can act to form a duct For this example it can be expressed a...

Страница 15: ...vity in the center of the socket with solder balls for surface mounting to the motherboard The socket is named LGA775 socket A description of the socket is in the LGA775 Socket Mechanical Design Guide...

Страница 16: ...on removal mechanical stress testing and standard shipping conditions When a compressive static load is necessary to ensure thermal performance of the thermal interface material between the heatsink b...

Страница 17: ...tecting LGA775 socket solder joints One of the strategies for mechanical protection of the socket is to use a preload and high stiffness clip This strategy is implemented by the reference design and d...

Страница 18: ...een installed into the chassis Minimizes contact with the motherboard surface during installation and actuation to avoid scratching the motherboard 2 2 Thermal Requirements Refer to the datasheet for...

Страница 19: ...orst case thermal environment The majority of ATX BTX platforms are targeted to function in an environment that will have up to a 35 C ambient temperature external to the system Note For ATX platforms...

Страница 20: ...temperature for the digital thermal sensor when the thermal solution fan speed is being controlled by the digital thermal sensor The TCONTROL parameter defines a very specific processor operating regi...

Страница 21: ...onduction path from the heat source to the heatsink fins and selecting materials with higher thermal conductivity typically improves heatsink performance The length thickness and conductivity of the c...

Страница 22: ...for the platforms designed with the LGA775 socket in Appendix H of this design guide The motherboard primary side height constraints defined in the ATX Specification V2 1 and the microATX Motherboard...

Страница 23: ...the datasheet and can be used as a baseline to predict heatsink performance during the design phase Intel recommends testing and validating heatsink performance in full mechanical enabling configurat...

Страница 24: ...the thermally advantaged chassis refer to Thermally Advantaged Chassis version 1 1 for Thermally Advantaged Chassis thermal and mechanical requirements 2 4 2 Improving Chassis Thermal Performance The...

Страница 25: ...ions in heatsink design include The local ambient temperature TA at the heatsink which is a function of chassis design The thermal design power TDP of the processor and the corresponding maximum TC as...

Страница 26: ...Processor Thermal Mechanical Information 26 Thermal and Mechanical Design Guidelines...

Страница 27: ...on that can rarely be accurately and easily modeled by a single resistance parameter like The case to local ambient thermal characterization parameter value CA is used as a measure of the thermal perf...

Страница 28: ...IHS System Board TC Heatsink TIM TS TA CA LGA775 Socket Processor IHS System Board TC Heatsink 3 1 1 Example The cooling performance CA is then defined using the principle of thermal characterization...

Страница 29: ...ufacturing process The TTV provides consistent power and power density for thermal solution characterization and results can be easily translated to real processor performance Accurate measurement of...

Страница 30: ...t heatsink If a barrier is used the thermocouple can be taped directly to the barrier with a clear tape at the horizontal location as previously described half way between the fan hub and the fan hous...

Страница 31: ...ical Design Guidelines 31 Figure 3 2 Locations for Measuring Local Ambient Temperature Active ATX Heatsink Note Drawing Not to Scale Figure 3 3 Locations for Measuring Local Ambient Temperature Passiv...

Страница 32: ...and the complete measurement system must be routinely checked against known standards When measuring the temperature of a surface that is at a different temperature from the surrounding local ambient...

Страница 33: ...die thermal management feature called Thermal Monitor is available on the processor It provides a thermal management approach to support the continued increases in processor frequency and performance...

Страница 34: ...signs to target maximum sustained current instead of maximum current Systems should still provide proper cooling for the VR and rely on bi directional PROCHOT signal only as a backup in case of system...

Страница 35: ...t represents the normal operating condition for the processor The second operating point consists of both a lower operating frequency and voltage When the TCC is activated the processor automatically...

Страница 36: ...al Control Circuit while using various registers and outputs to monitor the processor thermal status The Thermal Control Circuit is enabled by the BIOS setting a bit in an MSR model specific register...

Страница 37: ...to approximately 1 s on time 1 s total cycle time 3 1 s duty cycle Similarly for a duty cycle of 7 8 87 5 the clock on time would be extended to 21 s 21 21 3 7 8 duty cycle In a high temperature situa...

Страница 38: ...ximately 20 to 25 C At this point the system bus signal THERMTRIP goes active and power must be removed from the processor THERMTRIP activation is independent of processor activity and does not genera...

Страница 39: ...an speed control device Figure 4 3 TCONTROL for Digital Thermal Sensor Digital Thermometer Temperature 30 20 10 70 60 50 40 30 20 0 70 60 50 40 Tcontrol 66 Tcontrol 10 Fan Speed Temperature Time Power...

Страница 40: ...T see Chapter 7 and the Intel Quiet System Technology Configuration and Tuning Manual Intel has worked with many vendors that provide fan speed control devices to provide PECI host controllers Please...

Страница 41: ...w of the assembly is provided Figure 5 4 5 1 1 Target Heatsink Performance Table 5 1 provides the target heatsink performance for the processor with the BTX boundary conditions The results will be eva...

Страница 42: ...2 Duo 4 MB and 2 MB is due to a slight difference in the die size 3 BTX Type II reference TMA is the higher thermal solution performance of the Intel Core 2 Duo processor with 4 MB 2 MB cache at Tc ma...

Страница 43: ...e chassis and commercially available power supply Acoustic data for Case 2 will be provided in the validation report but this condition is not a target for the design The acoustic model is predicting...

Страница 44: ...forms Because of the coupling between TMA thermal performance and system impedance the designer should understand the TMA effective fan curve This effective fan curve represents the performance of the...

Страница 45: ...ling of the processor voltage regulator VR The reference design TMA will include a flow partitioning device to ensure an appropriate airflow balance between the TMA and the VR In validation the need f...

Страница 46: ...and overall heat capacity This often leads to some degradation in thermal solution performance compared to what is obtained at sea level with lower fan performance and higher surface temperatures The...

Страница 47: ...2 Hz flat Power Spectral Density PSD Profile 2 2 G RMS Figure 5 2 Random Vibration PSD Vibration System Level 0 0001 0 001 0 01 0 1 1 10 100 1000 Hz g 2 Hz 3 dB Control Limit 3 dB Control Limit 5 2 1...

Страница 48: ...stress test should be followed by a visual inspection and then BIOS CPU Memory test 5 2 1 2 2 Post Test Pass Criteria The post test pass criteria are 1 No significant physical damage to the heatsink...

Страница 49: ...rocessor All enabling components including socket and thermal solution parts Power supply Disk drive Video card DIMM Keyboard Monitor The pass criterion is that the system under test shall successfull...

Страница 50: ...an access the moving parts of the fan consider adding safety feature so that there is no risk of personal injury 5 5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly Figure 7 50 thro...

Страница 51: ...static preload to ensure protection against fatigue failure of socket solder joint The allowable preload range for BTX platforms is provided in Table 5 4 but the specific target value is a function of...

Страница 52: ...mal Module design should have a design preload and stiffness that lies within this region The design tolerance for the preload and TMA stiffness should also reside within this boundary Note that the l...

Страница 53: ...ut Duct front interface feature see note 2 SRM Front attach point use 6x32 screw See detail A Detail A See detail B Detail B Rear attach point use 6x32 screw Chassis PEM nut Duct front interface featu...

Страница 54: ...Balanced Technology Extended BTX Thermal Mechanical Design Information 54 Thermal and Mechanical Design Guidelines...

Страница 55: ...or E2000 series at Tc max of 61 4 C require a thermal solution equivalent to the D60188 001 reference design see Figure 6 1 for an exploded view of this reference design Note The part number D60188 00...

Страница 56: ...e The part number E18764 001 provided in this document is for reference only The revision number 001 may be subject to change without notice The E18764 001 reference design takes advantage of an acous...

Страница 57: ...Section 6 6 remain the same for a thermal solution for the processor in the 775 Land LGA package Note If this fan design is used in your product and you will deliver it to end use customers you have...

Страница 58: ...on 2 4 1 Table 6 1 D60188 001 Reference Heatsink Performance Processor Target Thermal Performance ca Mean 3 TA Assumption Notes Intel Core 2 Duo processor with 4 MB cache at Tc max of 60 1 C 0 31 C W...

Страница 59: ...ries at Tc max of 61 4 C Thermal Design Power Fan speed limited by the fan hub thermistor 1000 Low TA 28 C Minimum fan speed Table 6 4 Acoustic Results for ATX Reference Heatsink E18764 001 Fan Speed...

Страница 60: ...surface temperatures The system designer needs to account for altitude effects in the overall system thermal design to make sure that the TC requirement for the processor is met at the targeted altitu...

Страница 61: ...outlined here may differ from your own system requirements 6 3 1 1 Random Vibration Test Procedure Duration 10 min axis 3 axes Frequency Range 5 Hz to 500 Hz Power Spectral Density PSD Profile 3 13 G...

Страница 62: ...during burn in stage The stress test should be followed by a visual inspection and then BIOS CPU Memory test 6 3 1 2 2 Post Test Pass Criteria The post test pass criteria are 1 No significant physica...

Страница 63: ...abling components including socket and thermal solution parts Power supply Disk drive Video card DIMM Keyboard Monitor The pass criterion is that the system under test shall successfully complete the...

Страница 64: ...anical Design Figure 7 47 Figure 7 48 and Figure 7 49 in Appendix H gives detailed reference ATX ATX motherboard keep out information for the reference thermal mechanical enabling design These drawing...

Страница 65: ...particular upward board deflection Figure 6 6 In addition a moderate preload provides initial downward deflection Figure 6 6 Upward Board Deflection During Shock The target metal clip nominal stiffne...

Страница 66: ...insertion and is meant to be trapped between the core shoulder and the extrusion as shown in Figure 6 7 Figure 6 7 Reference Clip Heatsink Assembly Core shoulder traps clip in place Core shoulder tra...

Страница 67: ...p Core 1 6 mm Detail A Fin Array Clip Core 1 6 mm Detail A Fin Array Clip Core 1 6 mm Detail A Fin Array Clip Core 1 6 mm Figure 6 9 Critical Core Dimension R 0 40 mm max R 0 40 mm max 36 14 0 10 mm G...

Страница 68: ...ATX Thermal Mechanical Design Information 68 Thermal and Mechanical Design Guidelines...

Страница 69: ...Intel QST in particular rely on a thermal solution being compliant to the processor thermal profile It is unlikely that any fan speed control algorithm can compensate for a non compliant thermal solu...

Страница 70: ...gle fan respond to this sensor 7 1 2 Proportional Integral Derivative PID The use of Proportional Integral Derivative PID control algorithms allow the magnitude of fan response to be determined based...

Страница 71: ...perature Limit Temperature For a PID algorithm to work limit temperatures are assigned for each temperature sensor For Intel QST the TCONTROL for the processor and chipset are to be used as the limit...

Страница 72: ...owered DRAM with Channel A DIMM 0 installed and 2MB reserved for Intel QST FW execution SPI Flash with sufficient space for the Intel QST Firmware SST based thermal sensors to provide board thermal da...

Страница 73: ...ore 2 Duo processor With the proper configuration information the ME can be accommodate inputs from PECI or SST for the processor socket Additional SST sensors can be added to monitor system thermal s...

Страница 74: ...ontrol between Intel QST and the thermistor but they can work in tandem to provide the maximum fan speed reduction The BTX reference design includes a thermistor on the fan hub This Variable Speed Fan...

Страница 75: ...actuated In addition solder joint shear stress is caused by coefficient of thermal expansion CTE mismatch induced shear loading The solder joint compressive axial force Faxial induced by the heatsink...

Страница 76: ...n metric provides guidance for mechanical designs that differ from the reference design for ATX ATX form factor A 2 2 Motherboard Deflection Metric Definition Motherboard deflection is measured along...

Страница 77: ...n Limits Deflection limits for the ATX ATX form factor are d_BOL d_ref 0 09 mm and d_EOL d_ref 0 15 mm And d _BOL d _ref 0 09 mm and d_EOL d_ref 0 15 mm NOTES 1 The heatsink preload must remain within...

Страница 78: ...creep phenomenon The example accounts for the creep expected to occur in the motherboard It assumes no creep to occur in the clip However there is a small amount of creep accounted for in the plastic...

Страница 79: ...eflect 0 37 mm minimum at BOL Additional deflection as high as 0 09 mm may be necessary to account for additional creep effects impacting the board clip fastener assembly As a result designs could see...

Страница 80: ...the board deflection recommendation refer to Section A 2 3 with a very stiff board may lead to heatsink preloads exceeding package maximum load specification For example such a situation may occur wh...

Страница 81: ...7 8 and Figure 7 9 The load cells should be distributed evenly as close as possible to the pocket walls Apply wax around the circumference of each load cell and the surface of the pocket around each...

Страница 82: ...gn is Machine the pocket in the heat sink base to a depth such that the tips of the load cells are just flush with the heat sink base Then machine back the heatsink base by around 0 25 mm 0 01 so that...

Страница 83: ...eatsink Base Pocket Side View Figure 7 10 Preload Test Configuration Load Cells 3x Preload Fixture copper core with milled out pocket Wax to maintain load cell in position during heatsink installation...

Страница 84: ...a recording and control with a 6101 PCI card GPIB added to the scanner allowing it to be connected to a PC running LabVIEW or Vishay s StrainSmart software 4 IMPORTANT In addition to just a zeroing of...

Страница 85: ...m time to allow the load cell to settle is generally specified by the load vendors often of order of 3 minutes The time zero reading should be taken at the end of this settling time 5 Record the prelo...

Страница 86: ...Heatsink Clip Load Metrology 86 Thermal and Mechanical Design Guidelines...

Страница 87: ...a do not translate to a measurable improvement in thermal performance C 3 Interface Material Performance Two factors impact the performance of the interface material between the processor and the heat...

Страница 88: ...Thermal Interface Management 88 Thermal and Mechanical Design Guidelines...

Страница 89: ...followed by the reference procedure The supplier is listed the following table as a convenience to Intel s general customers and the list may be subject to change without notice Supplier Contact Phon...

Страница 90: ...ormation OSK2K1280 5SR TC TT T 36 72 Calibration and Control Ice Point Cell Omega stable 0 C temperature source for calibration and offset TRCIII Hot Point Cell Omega temperature source to control and...

Страница 91: ...mpacted by impedance There are numerous resources available throughout the industry to assist with implementation of proper controls for thermal measurements NOTES 1 It is recommended to follow compan...

Страница 92: ...Case Temperature Reference Metrology 92 Thermal and Mechanical Design Guidelines Figure 7 12 775 LAND LGA Package Reference Groove Drawing at 6 o clock Exit...

Страница 93: ...Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 93 Figure 7 13 775 LAND LGA Package Reference Groove Drawing at 3 o clock Exit Old Drawing...

Страница 94: ...otch as shown Figure 7 15 Figure 7 15 IHS Groove at 6 o clock Exit Orientation Relative to the LGA775 Socket Select a machine shop that is capable of holding drawing specified tolerances IHS groove ge...

Страница 95: ...ng and Preparation 7 Use a calibrated thermocouple as specified in Sections D 2 and D 3 8 Under a microscope verify the thermocouple insulation meets the quality requirements The insulation should be...

Страница 96: ...wire and bead extend about 1 5 mm 0 030 inch past the end of groove Secure it with Kapton tape Figure 7 18 Clean the IHS with a swab and IPA 14 Verify under the microscope that the thermocouple wires...

Страница 97: ...t is also recommended to use a fixture like processor tray or a plate to help holding the unit in place for the rest of the attach process 17 While still at the microscope press the wire down about 6m...

Страница 98: ...n Guidelines Figure 7 20 Position Bead on the Groove Step Figure 7 21 Detailed Thermocouple Bead Placement TC Wire with Insulation IHS with Groove TC Bead Figure 7 22 Third Tape Installation Wire sect...

Страница 99: ...ng process 19 Measure resistance from thermocouple end wires hold both wires to a DMM probe to the IHS surface This should be the same value as measured during the thermocouple conditioning Section D...

Страница 100: ...to the Thermocouple Bead 21 Cut two small pieces of solder 1 16 inch 0 065 inch 1 5 mm from the roll using tweezers to hold the solder while cutting with a fine blade see Figure 7 25 Figure 7 25 Cutti...

Страница 101: ...contacting the IHS D 5 3 Solder Process 24 Make sure the thermocouple that monitors the Solder Block temperature is positioned on the Heater block Connect the thermocouple to a handheld meter to monit...

Страница 102: ...e to the device in the solder status to get a better view when the solder begins to melt 29 Lower the Heater block onto the IHS Monitor the device IHS temperature during this step to ensure the maximu...

Страница 103: ...Case Temperature Reference Metrology Thermal and Mechanical Design Guidelines 103 Figure 7 28 View Through Lens at Solder Station Figure 7 29 Moving Solder back onto Thermocouple Bead...

Страница 104: ...clockwise Using the back of the tweezers press down on the solder this will force out the excess solder Figure 7 30 Removing Excess Solder 32 Allow the device to cool down Blowing compressed air on th...

Страница 105: ...t for re use 34 Straighten the wire and work the wire in to the groove Bend the thermocouple over the IHS Replace the long piece of Kapton tape at the edge of the IHS Note The wire needs to be straigh...

Страница 106: ...e rest of the groove with Loctite 498 Adhesive Verify under the microscope that the thermocouple wire is below the surface along the entire length of the IHS groove see Figure 7 33 Figure 7 33 Filling...

Страница 107: ...e adhesive is partially cured but still soft This will help to keep the adhesive surface flat and smooth with no pits or voids If there are voids in the adhesive refill the voids with adhesive and sha...

Страница 108: ...ouple wires are damaged the resulting reading maybe wrong For example if there are any cuts into the wires insulation where the wires are pinched between the heatsink and the socket lid when installin...

Страница 109: ...used interchangeably for the Digital thermal sensor or on die thermal diode On die thermal diode will only be used when required for clarity E 1 Thermal Solution Design The first step is to select or...

Страница 110: ...ents for another portion of the design such as the processor voltage regulator or by functional limits of the fan design Per the Fan Specification for 4 wire PWM Controlled Fans there are three possib...

Страница 111: ...he functionality embedded Intel has engaged with a number of major manufacturers of FSC components to provide devices that have a PECI host controller Contact your Intel Field Sales representative for...

Страница 112: ...designer might initially consider a small temperature range TCONTROL TLOW TRANGE 5 C to accelerate the fan That would delay the fan accelerating for the longest time after an increase in TSENSOR Ther...

Страница 113: ...an speed oscillation are significantly reduced Maximum fan speed is lower The rate of change of CA vs RPM is an exponential curve with a larger decrease at the beginning of the fan acceleration than a...

Страница 114: ...nded For BTX Boxed Processor enabled reference solutions TRANGE value of 7 C is recommended E 2 1 2 Minimum PWM Duty Cycle The final step in determining the FSC setting is to determine the minimum PWM...

Страница 115: ...Min Operating Variable Speed Fan VSF Curve Fan Speed Operating Range with FSC 34 Min Fan Speed PWM Duty Cycle 100 Fan Speed RPM Inlet Temperature C Full Speed 30 38 Min Operating Variable Speed Fan V...

Страница 116: ...iode Correction Factor Thermal Diode Correction Factor Thermal Diode Correction Factor is the sum of the Thermal Diode Offset and Thermal Diode Base This value is used to compensate for temperature er...

Страница 117: ...urement capability required Must support PECI and thermal diode using a SST device External remote thermal sensor sampling rate 4 times per second required External remote diode measurement SST device...

Страница 118: ...5 NOTES 1 A PWM frequency of 25 kHz is the design target for the reference and for the Intel Boxed Processor and the reference design 2 Use the lowest time available in this range for the device sele...

Страница 119: ...amp range control or spike smoothing Select the lowest setting available close to 4 0 seconds by the fan speed control device 4 The Fan Speed Controller or Health Monitor Component takes the result of...

Страница 120: ...Legacy Fan Speed Control 120 Thermal and Mechanical Design Guidelines...

Страница 121: ...ator is typically responsible for ensuring compliance with the component temperature specifications at all operating conditions and therefore should be responsible for specifying the System Monitor th...

Страница 122: ...Fremont CA 94538 USA 510 252 0786 phone 510 252 1178 fax sales bizlinktech com Part Number 68801 0170 Molex Incorporated 2222 Wellington Ct Lisle IL 60532 1 800 78MOLEX phone 1 630 969 1352 fax amerin...

Страница 123: ...Balanced Technology Extended BTX System Thermal Considerations Thermal and Mechanical Design Guidelines 123 Figure 7 46 Thermal sensor Location Illustration TMA Airflow Thermal Sensor MCH Heatsink...

Страница 124: ...Balanced Technology Extended BTX System Thermal Considerations 124 Thermal and Mechanical Design Guidelines...

Страница 125: ...age for logic low VIL 0 8 V PWM compliant function RPM must be within spec for specified duty cycle In addition to comply with overall thermal requirements Sections 5 1 1 and 6 2 and the general envir...

Страница 126: ...Fan Performance for Reference Design 126 Thermal and Mechanical Design Guidelines...

Страница 127: ...Fan Performance for Reference Design Thermal and Mechanical Design Guidelines 127...

Страница 128: ...Height Restrictions for Enabling Components Sheet 2 130 ATX ATX Motherboard Keep out Footprint Definition and Height Restrictions for Enabling Components Sheet 3 131 BTX Thermal Module Keep Out Volume...

Страница 129: ...OMPONENT HEIGHT BOARD ROUTING KEEP OUT SHEET 1 OF 3 DO NOT SCALE DRAWING SCALE NONE 3 C40819 D REV DRAWING NUMBER CAGE CODE SIZE LGA775 microATX COMPONENT KEEP INS TITLE 2200 MISSION COLLEGE BLVD P O...

Страница 130: ...E DISCLOSED REPRODUCED DI SPLAYED OR MODIFIED WITHOUT THE PRI OR WRITTEN CONSENT OF INTEL CORPORAT ION 4X 6 00 4X 10 00 LEGEND COMPONENT KEEP OUT ROUTING KEEP OUT SHEET 2 OF 3 DO NOT SCALE DRAWING SCA...

Страница 131: ...D REV DRAWING NUMBER CAGE CODE SIZE DEPARTMENT C40819 3 3 DWG NO SHT REV LEVER MOTION SPACE REQUIRED TO RELEASE SOCKET LOAD PLATE NOTES 1 SOCKET CENTER PLANES ARE REFERENCED FROM GEOMETRIC CENTER OF...

Страница 132: ...Mechanical Drawings 132 Thermal and Mechanical Design Guidelines Figure 7 50 BTX Thermal Module Keep Out Volumetric Sheet 1...

Страница 133: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 133 Figure 7 51 BTX Thermal Module Keep Out Volumetric Sheet 2...

Страница 134: ...Mechanical Drawings 134 Thermal and Mechanical Design Guidelines Figure 7 52 BTX Thermal Module Keep Out Volumetric Sheet 3...

Страница 135: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 135 Figure 7 53 BTX Thermal Module Keep Out Volumetric Sheet 4...

Страница 136: ...Mechanical Drawings 136 Thermal and Mechanical Design Guidelines Figure 7 54 BTX Thermal Module Keep Out Volumetric Sheet 5...

Страница 137: ...3D DATABASE FILE ALL DIMENSIONS AND TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE AND ARE APPLICABLE AT PART FREE UNCONSTRAINED STATE UNLESS INDICATED OTHERWISE 2 MATERIAL A TYPE AISI...

Страница 138: ...22 45 X 8 0 45 0 05 018 001 45 X 8 0 25 0 05 010 001 C85609 2 0 DWG NO SHT REV DEPARTMENT R CORP 2200 MISSION COLLEGE BLVD P O BOX 58119 SANTA CLARA CA 95052 8119 TMD SIZE DRAWING NUMBER REV A1 C85609...

Страница 139: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 139 Figure 7 57 Reference Fastener Sheet 1...

Страница 140: ...Mechanical Drawings 140 Thermal and Mechanical Design Guidelines Figure 7 58 Reference Fastener Sheet 2...

Страница 141: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 141 Figure 7 59 Reference Fastener Sheet 3...

Страница 142: ...Mechanical Drawings 142 Thermal and Mechanical Design Guidelines Figure 7 60 Reference Fastener Sheet 4...

Страница 143: ...Mechanical Drawings Thermal and Mechanical Design Guidelines 143 Figure 7 61 Intel D60188 001 Reference Solution Assembly...

Страница 144: ...Mechanical Drawings 144 Thermal and Mechanical Design Guidelines Figure 7 62 Intel D60188 001 Reference Solution Heatsink...

Страница 145: ...IGNED BY DRAWN BY CHECKED BY APPROVED BY DATE DATE DATE DATE DO NOT SCALE DRAWING SCALE 1 1 SHEET 1 OF 1 DRAWING NUMBER CAGE CODE SIZE C TITLE DEPARTMENT R REV 5000 W CHANDLER BLVD CHANDLER ARIZONA 85...

Страница 146: ...the tables identify these reference components End users are responsible for the verification of the Intel enabled component offerings with the supplier OEMs and System Integrators are responsible for...

Страница 147: ...ck Chen Foxconn c om Wanchi Chen Foxcon n com Fujikura Intel E18764 001 Reference Solution RPG 7029 Yuji Yasuda 408 988 7478 yuji fujikura com Nidec Intel E18764 001 Reference Solution F09A 12BS201AC...

Страница 148: ...ension 619 NOTES 1 Part numbers were not available at the time of release of this document Contact the company for part number identification prior to the next revision of this document 2 The user sho...

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