8. Typical Applications
256
Tsi308 User Manual
80D4000_MA001_02
Tundra Semiconductor Corporation
www.tundra.com
Figure 23: PCB Stackup for HyperTransport
Notes on the Stackup
Design:
1.
The stackup is based
on 5 mil nominal trace
width on both internal
and external layers.
2.
Impedance is
nominally 60
Ω
with
the dielectrics shown.
All internal signal
layers are ½ oz
copper.
3.
All internal reference
planes are 1 oz
copper.
4.
Overall board
thickness is 91.6 mils
measured between
outer resin surfaces.
1
2
3
4
5
6
7
8
9
10
11
12
GND
2.5V/5V
GND
3.3V
GND
GND
5
8
8
8
8
8
8
8
8
8
5
Recommended Stackup
With Single Striplines
Summary of Contents for TSI308
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