5. Electrical Characteristics
206
Tsi308 User Manual
80D4000_MA001_02
Tundra Semiconductor Corporation
www.tundra.com
5.11
Power Consumption
Tsi308 power consumption can be accurately calculated for specific configurations with a
spreadsheet available upon request from Alliance Semiconductor.
5.12
Thermal Data
Table 30: Recommended Operating Temperature
Grade
Temperature
Commercial
0
°
to +70
°
ambient
Table 31: Thermal Maximum
Parameter
Value
Unit
Die Temperature
Maximum
125
°C
Maximum Power
7
W
Table 32: Thermal Characteristics
Parameter
Symbol
Package
Air Flow
Value
Unit
Thermal resistance
(junction to ambient)
JA
388 HSBGA
0 m/s
13.2
°C/W
1 m/s
12.0
2 m/s
10.5
388 HSBGA w/ Heat Sink
a
a. Recommended heat sink is Aavid 374524B00032.
0 m/s
9.8
1 m/s
7.0
2 m/s
6.4
Thermal resistance
(junction to case)
JC
--
--
3.8
°C/W
Thermal Characterization
Parameter
(junction to top center)
ψ
JT
--
--
2.4
°C/W
Summary of Contents for TSI308
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