5. Electrical Characteristics
207
Tsi308 User Manual
80D4000_MA001_02
Tundra Semiconductor Corporation
www.tundra.com
5.13
Thermal Recommendations
The worst-case scenario for the Tsi308 device is to maintain a junction temperature of 125°C
with an ambient temperature of 70°C and a power dissipation of 7 watts. The required
JA
to
accomplish this is 7.9°C/W or less.
From Table 7-15, it can be seen that this thermal performance is possible by using the
recommended Aavid 374524B00032 heat sink with 1 m/s or greater air flow.
Applications with a lower ambient temperature and/or less power dissipation may require less
air flow and/or no heat sink. A spreadsheet to help determine the thermal requirements for a
Tsi308 application is available upon request from Alliance Semiconductor. Alliance can also
give recommendations on alternate heatsinks.
Figure 19: Recommended Heat Sink for Tsi308
Summary of Contents for TSI308
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