8. Typical Applications
255
Tsi308 User Manual
80D4000_MA001_02
Tundra Semiconductor Corporation
www.tundra.com
8.5
Example PCB Stackup for HyperTransport
The following example PCB stack-up will provide a 60-ohm single-ended impedance or a
100-ohm differential impedance if a 5 mil wide trace is used with 5 mil spacing on any signal
layer.
AA24
L1_RX_CAD_H[0]
10.029
0.3948
100.29
AA25
L1_RX_CAD_L[0]
9.797
0.3857
97.97
V24
L1_RX_CLK_H
8.544
0.3364
85.44
V25
L1_RX_CLK_L
8.587
0.3381
85.87
R26
L1_RX_CTL_H
9.514
0.3746
95.14
P26
L1_RX_CTL_L
9.356
0.3684
93.56
Table 44: Pad-to-Ball Trace Length Information
Ball number
Signal Name
Pad to Ball Trace
Length [mm]
Pad to Ball Trace
Length [inches]
Pad to Ball Trace
Propagation Delay [ps]
Summary of Contents for TSI308
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