SMART Embedded Computing 6806800V18A, Installation And Use Manual

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Shelf Management Module
AXP1440-C07 Installation and Use (6806800V18A) 141

I/O interfaces available on a Tyco 220-pin 0.5mm Free Height receptacle

64 or 128MBytes of DDR SDRAM with Error Correcting Code (ECC) support

266 or 400MHz PowerPC superscalar RISC core with MMU and caches (32K/32K
with parity)

32 or 64MBytes of flash

Hardware support for a reliable upgrade of software images in flash

Dual IPMB with IPMB buffer controls for hot insertion and removal onto a live
backplane

Dual serial interface at RS-232 or CMOS levels (one port with modem control)

Dual 10/100Mbit Ethernet using the integrated 802.3 controllers buffered by
external on-board PHY layer devices

FPGA device on the PCI bus used to implement IPMB-0, the shelf manager-
oriented interfaces for hardware redundancy, hot swap, and carrier ID, plus the
ATCA Watchdog and a high-speed serial interface for an alternate software
redundancy interface between peer ShMM-1500Rs

Three general-purpose I
2
C interfaces (one with limitations) for access to on-carrier
devices, such as hardware monitors and the alarm interface

RTC (backed by on-carrier battery)

User SEEPROM

External interrupt inputs

User GPIO

SPI interface as an extension interface for on-carrier devices

PCI interface as an extension interface for on-carrier devices

On-carrier PLD interface

JTAG interface for software debug and manufacturing
7.3 Functional Description
The SAM1620-D has a high-density 220-pin socket for the ShMM-1500R device and front
panel connectors for the serial console, Ethernet, and alarm signals of the mezzanine. The
dual-IPMB interface from the mezzanine is connected to the dual IPMBs in the backplane.
The SAM1620-D includes several on-board devices that enable different aspects of shelf
management based on the shelf management mezzanine. These facilities include I
2
C-
based hardware monitoring/control and GPIO expander devices.