11.1 Product Specifications
This section describes the specifications of G560, GP608, G530 V2, and GP316.
Table 11-1
G560 specifications
No.
Item
Specifications
1.1
NVMe SSD
Up to six 2.5-inch NVMe SSDs. The NVMe SSD backplane
provides six PCIe 3.0 x4 slots for connecting to NVMe
SSDs. The SSDs can be installed and removed
independently and support scheduled hot-swap. Violence
hot-swap is not supported.
1.2
SATA or SAS hard
disk
Up to two 2.5-inch SAS or SATA hard disks. The hard disk
backplane provides two SAS or SATA ports for connecting
to hard disks. The hard disks are hot-swappable and can be
independently installed and removed.
2
TPM (optional)
Supports TPM 1.2 and TPM 2.0. The TPM is a cost-
effective security solution that complies with the Trusted
Computing Group (TCG) standards. It enhances platform
security by preventing viruses or unauthorized operations.
3
Supercapacitor
(optional)
If the LSI SAS3108 RAID controller card is used, the
supercapacitor provides power-off protection.
4
Mainboard
As the most important component of the G560, the
mainboard integrates basic components, such as the BIOS
chip and PCH chip, and provides processor sockets and
DIMM slots.
5
RAID controller
card
The RAID controller card expands the storage capacity of
the compute node through hard disks and ensures data
security. The G560 supports the LSI SAS3008 and LSI
SAS3108 RAID controller cards. The RAID controller card
provides two SAS or SATA ports for connecting to two 2.5-
inch SAS or SATA hard disks. RAID 0 and RAID 1 are
supported. The LSI SAS3108 supports RAID 0, 1, 5, 6, 10,
50, and 60 through a maximum of eight 3.5-inch SAS or
SATA hard disks in the GP608.
A supercapacitor can be configured to provide power-off
protection for the LSI SAS3108 RAID controller card.
FusionServer G5500 Server
User Guide
11 Specifications
Issue 02 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
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