No.
Item
Specifications
6
Memory
The mainboard provides 24 slots for installing DDR4
DIMMs (12 DIMMs for each processor).
l
Maximum memory speed: 2400 MHz
l
Memory protection: ECC, memory mirroring, and
memory sparing
l
DIMM types: RDIMMs and LRDIMMs. DIMMs on the
same compute node must be of the same type (RDIMM
or LRDIMM) and the same specifications (capacity, bit
width, rank, and height), and have the same BOM
number. To query DIMM BOM numbers, use the
.
–
RDIMMs: When twenty-four 32 GB RDIMMs and
two CPUs are configured, the maximum memory
capacity is 768 GB.
–
LRDIMMs: When twenty-four 64 GB LRDIMMs
and two CPUs are configured, the maximum memory
capacity is 1536 GB.
7
CPU
The mainboard supports two CPUs.
l
The following CPU models are supported:
Intel® Xeon® E5-2600 v4 (Broadwell-EP) series
processors, each supporting a maximum of 22 cores.
l
Each processor integrates four memory controllers for
supporting four DDR4 memory channels. Each channel
supports three DDR4 DIMMs of 1600/1866/2133/2400
MHz.
l
Each processor integrates PCIe controllers for supporting
PCIe 3.0 and providing 40 lanes.
l
The two processors are interconnected through two QPI
buses at 9.6 GT/s.
l
The maximum frequency is 3.5 GHz.
NOTE
The G560 does not support single-processor configuration, and the
two processors must be of the same model.
8
Heat sink
Cools CPUs. Each CPU is configured with one heat sink.
9
DIMM air duct
Provides ventilation channels for DIMMs.
10
Mezzanine card
Two mezzanine cards. Each mezzanine card provides two
PCIe 3.0 x16 channels and is connected to the mainboard
through four connectors and to the GP608 through the
chassis backplane. For details, see
.
FusionServer G5500 Server
User Guide
11 Specifications
Issue 02 (2017-12-15)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
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