MC96F6432
June 22, 2018 Ver. 2.9
53
7.22 Recommended Circuit and Layout
{
}
M
C
9
6
F
6
4
3
2
XOUT
XIN
I/O
VSS
VDD
High-Current Part
Infrared LED,
FND(7-Segment),
,,,,,
etc
{ }
0.01uF
VCC
0.1uF
This 0.1uF capacitor should be within
1cm from the VDD pin of MCU on the
PCB layout.
{
}
This 0.01uF capacitor is alternatively
for noise immunity.
X-tal
SXOUT
SXIN
32.768kHz
The main and sub crystal should be
as close by the MCU as possible.
+
0.1uF
VDD
VCC
{
}
The MCU power line (VDD and VSS)
should be separated from the high-
current part at a DC power node on
the PCB layout.
DC Power
The load capacitors of the sub clock
- C1, C2: C
L
x 2 ± 15%
- C
L
= (C1 x C2)/(C1 + C2) - Cstray
- C
L
: the specific capacitor value of crystal
- Cstray: the parasitic capacitor of a PCB (1pF
–
1.5pF)
C1
C2
Figure 7.15 Recommended Circuit and Layout
Summary of Contents for MC96F6332D
Page 24: ...MC96F6432 24 June 22 2018 Ver 2 9 4 Package Diagram Figure 4 1 48 Pin LQFP 0707 Package...
Page 25: ...MC96F6432 June 22 2018 Ver 2 9 25 Figure 4 2 44 Pin MQFP Package...
Page 26: ...MC96F6432 26 June 22 2018 Ver 2 9 Figure 4 3 32 Pin LQFP Package...
Page 27: ...MC96F6432 June 22 2018 Ver 2 9 27 Figure 4 4 32 Pin SOP Package...
Page 28: ...MC96F6432 28 June 22 2018 Ver 2 9 Figure 4 5 28 Pin SOP Package...
