Accelnet Plus Micro Modules User Guide
16-01687 Rev 03
Copley Controls
Page 37 of 139
I
NTEGRATION
G
UIDELINES FOR
AEV
&
APV
M
ODULES
U
SER
M
OUNTING
B
OARD
(UMB)
D
ESIGN
UMB
D
ESIGN
R
ULES
The UMB board design should incorporate three zones, each with different design rules.
•
STO
•
Signals
•
Power & Motor
Standard IPC 2152 is used to determine trace thickness and widths needed to carry the
required currents. Standard IEC 60664-1 provides the spacing of conductors that will
provide the necessary insulation required to ensure that the circuits in each zone function
well without interfering with circuits in other zones.
PCB
S
PACINGS
The AEV and APV drives do not have the shielding and grounding provided by enclosed
panel-mounting drives As a result, the user must provide for grounding and spacing of
conductors in their PCB design.
Spacings of conductors on the UMB are of two types: Clearance and Creepage.
•
Clearance
is the straight line distance between two traces.
Primarily affected by air pressure (altitude) and voltage between the traces.
•
Creepage
is the distance between traces over the surface of the UMB.
Primarily affected by air pressure (altitude) and humidity
•
Spacings between safety and non-safety circuits must be designed to exclude the
possibility of short circuit faults between safety and non-safety circuits.
M
ANDATORY
D
ESIGN
R
ULES FOR
STO
When the STO feature of the drive is used, these rules are required. These are illustrated
in the graphic below. Sufficient clearance and creepage distances must be exist for the
STO connections in order to exclude certain short circuit faults from consideration in the
FMEDA. Additional details provided in Section 6.11.
Spacings are based on the Pollution Degree which is defined in IEC 60664-1.
The AEV & APV are designed for Pollution degree 2:
•
Pollution Degree 2: Normally only nonconductive pollution occurs.
Occasionally, however, a temporary conductivity caused by condensation
is to be expected, when the drive is out of operation.