Accelnet Plus Micro Modules User Guide
16-01687 Rev 03
Copley Controls
Page 31 of 139
4
C
ONNECTIONS AND
W
IRING
-
M
ODULES
J2: Feedback
Dual row, 0.050 inch centers
64 position female header
SAMTEC FLE-132-01-G-DV-K-TR
Top view looking down on mounting PC board
J1 Signal Grouping
for current-sharing
Notes
1. J1 signals must be connected for current-
sharing.
2. To determine copper width and thickness for J1
signals refer to specification IPC-2221.
(Association Connecting Electronic Industries,
http://www.ipc.org)
3. Standoffs should be connected to etches on pc
board that connect to frame ground for
maximum noise suppression and immunity.
They also provide the PE (Protective Earth)
connection between the heatplate and ground.
Dimensions are in inches [mm]
For Sockets on User PC Board:
Qty Description
Mfgr
Part Number
Ref Des
Remarks
1
Socket Strip
Samtec
SQT-119-01-G-D
J1
2.00 mm (0.0787 in) pitch
1
Socket Strip
Samtec
FLE-132-01-G-DV
J2
0.050" (1.27 mm) pitch
1
Socket Strip
Samtec
TLE-102-01-G-DV-TR
J3
2.00 mm (0.0787 in) pitch
2 Standoff hex, 13 mm long, M2,5 mm thread
For Soldering to User PC Board:
Qty Description
Mfgr
Part Number
Ref Des
Remarks
1
For J1, refer to this document:
http://suddendocs.samtec.com/processing/through-hole-printing.pdf
1
Socket Strip
Samtec
CLP-132-02-L-D-BE-A-K-TR J2
0.050" (1.27 mm) pitch
1
Socket Strip
Samtec
CLT-102-2-G-D-BE
J3
2.00 mm (0.0787 in) pitch
2
Standoff
hex, 19 mm long, M 2.5 mm thread