L-827e.A3 phyCORE-i.MX 6UL/ULL Hardware Manual
© PHYTEC Messtecknik GmbH
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20 Hints for Integrating and Handling the phyCORE-i.MX 6UL/ULL
20.1 Integrating the phyCORE-i.MX 6UL/ULL
20.1.1 Design Rules
Successful integration in user target circuitry greatly depends on the adherence to the layout design rules for the
GND connections of the phyCORE module. For maximum EMI performance, we recommend as a general design rule
to connect all GND pins to a solid ground plane. But at least all GND pins neighboring signals which are being used
in the application circuitry should be connected to GND.
20.1.2 Additional information and Reference Design
Besides this hardware manual, much information is available to facilitate the integration of the phyCORE
‑
i.MX 6UL/
ULL into customer applications.
the design of the phyBOARD
‑
Segin i.MX 6UL/ULL can be used as a reference for any customer application
many answers to common questions can be found at
the link “Carrier Board” within the category Dimensional Drawing leads to the layout data as shown in
Physical Dimensions (bottom view)
. It is available in different file formats. The use of this data integrates the
phyCORE-i.MX 6UL/ULL SOM as a single component of your design.
different support packages are available to support you in all stages of your embedded development. Please
visit
https://www.phytec.de/support/support-pakete/
https://www.phytec.eu/en/support/support-
, or contact our sales team for more details.
20.2 Handling the phyCORE-i.MX 6UL/ULL
20.2.1 Modifications on the phyCORE Module
Removal of various components, such as the microcontroller and the standard quartz, is not advisable given the
compact nature of the module. Should this nonetheless be necessary, please ensure that the board, as well as
surrounding components and sockets, remain undamaged while de-soldering. Overheating the board can cause the
solder pads to loosen, rendering the module inoperable. Carefully heat neighboring connections in pairs. After a
few alternations, components can be removed with the solder-iron tip. Alternatively, a hot air gun can be used to
heat and loosen the bonds.
Warning
If any modifications to the module are performed, regardless of their nature, the manufacturer guarantee
is voided.