L-827e.A3 phyCORE-i.MX 6UL/ULL Hardware Manual
© PHYTEC Messtecknik GmbH
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Humidity
:
95 % r.F. not condensed
Operating voltage
:
VCC 3.3 V +/- 5 %
Power consumption
:
Linux prompt only: typical 0.5 W
Full load: typical 1 W
Conditions:
512 MB DDR3-SDRAM, 512 MB NAND Flash, Ethernet, G2 528 MHz
CPU frequency, 20 °C, 3.3 V
These specifications describe the standard configuration of the phyCORE
‑
i.MX 6UL/ULL as of the printing of this
manual.
18. Depending on the configuration of the module.
19.1 Product Temperature Grades
The feasible operating temperature of the SOM highly depends on the use case of your software application.
Modern high-performance microcontrollers and other active parts such as the ones described within this manual
are usually rated by qualifications based on tolerable junction or case temperatures. Therefore, making a general
statement about maximum or minimum ambient temperature ratings for the described SOM is not possible.
However, the above-mentioned parts are available still at different temperature qualification levels by the
producers. We offer our SOM's in different configurations making use of those temperature qualifications. To
indicate which level of temperature qualification is used for active and passive parts of a SOM configuration we
have categorized our SOMs into three temperature grades. The table below describes these grades in detail. These
grades describe a set of components that in combination add up to a useful set of product options with different
temperature grades. This enables us to make use of cost optimizations depending on the required temperature
range.
In order to determine the right temperature grade and whether the maximum or minimum qualification levels are
met within an application the following conditions must be defined by considering the use case:
Determined the processing load for the given software use case
Maximum temperature ranges of components (see table below)
Power consumption resulting from a baseload and the calculating power required (in consideration of peak
loads as well as time periods for system cooldown)
Surrounding temperatures and existing airflow in case the system is mounted into a housing
Heat resistance of the heat dissipation paths within the system along with the considered usage of a heat
spreader or a heat sink to optimize heat dissipation
Warning
The right temperature grade of the Module depends very much on the use case. It is mandatory to
determine if the use case suites the temperature range of the chosen module (see below). If necessary a
heat spreader can be used for temperature compensation.