Oracle X5-2L, Service Manual, Page: 36 / 324

Troubleshoot Hardware Faults Using the Oracle ILOM Web Interface
36 Oracle Server X5-2L Service Manual • May 2015
airflow through the server is disrupted and the cooling system fails to function properly causing
the server internal temperature to rise.
Action
: Inspect the server front and back panel vents for blockage from dust or debris.
Additionally, inspect the server interior for improperly installed components or cables that can
block the flow of air through the server.
Prevention
: Periodically inspect and clean the server vents using an ESD certified vacuum
cleaner. Ensure that all components, such as cards, cable, fans, air baffles and dividers are
properly installed. Never operate the server without the top cover installed.
Cooling Areas Compromised
To function properly, the server has cooling areas that are maintained by an air baffle,
component filler panels, and the server top cover. These server components need to be in place
for the server to function as a sealed system. If internal cooling areas are compromised, the
server cooling system, which relies on the movement of cool air through the server, cannot
function properly, and the airflow inside the server becomes chaotic and non-directional.
Action : Inspect the server interior to ensure that the air baffle is properly installed. Ensure that
all external-facing slots (storage drive, DVD, PCIe) are occupied with either a component or a
component filler panel. Ensure that the server top cover is in place and sits flat and snug on top
of the server.
Prevention : When servicing the server, ensure that the air baffle is installed correctly and that
the server has no unoccupied external-facing slots. Never operate the server without the top
cover installed.
Hardware Component Failure
Components, such as power supplies and fan modules, are an integral part of the server cooling
system. When one of these components fails, the server internal temperature can rise. This rise
in temperature can cause other components to enter into an over-temperature state. Additionally,
some components, such as processors, might overheat when they are failing, which can also
generate an over-temperature event.
To reduce the risk related to component failure, power supplies and fan modules are installed
in pairs to provide redundancy. Redundancy ensures that if one component in the pair fails,
the other functioning component can continue to maintain the subsystem. For example, power
supplies serve a dual function; they provide both power and airflow. If one power supply fails,
the other functioning power supply can maintain both the power and the cooling subsystems.
Action
: Investigate the cause of the over-temperature event, and replace failed components
immediately . For hardware troubleshooting information, see “Troubleshooting Server Hardware
Faults” on page 26 .