Lenovo System x3750 M4, Installation And Service Manual

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• Do not touch the thermal grease on the bottom of the heat sink after you remove the plastic
cover. Touching the thermal grease will contaminate it. See “Thermal grease” on page
98 for more information.
Step 11. Install the heat sink that came with the microprocessor:
a. Remove the plastic protective cover from the bottom of the heat sink.
b. Align the heat sink on the top of the microprocessor with the thermal grease side down.
c. Align the captive screws on the heat sink with the holes on the heat-sink retention module.
d. Press down on the center of the heat sink, and then press firmly on the captive screws and
tighten them, alternating between the screws in a figure-8 pattern as illustrated on the heat
sink label until they are tightened. You can cause damage to the microprocessor if you tighten
the screws on one side first, rather than rotating. Rotate each screw one full rotation at a time.
Repeat this process until the screws are tightened.
Step 12. Reinstall the microprocessor air baffle (see “Replacing the microprocessor air baffle” on page 124).
Note: A microprocessor air baffle must be installed whenever the DIMM connectors closest to the
microprocessor (on the left and the right) are empty. For example, when DIMM connectors 6 and 7
on the system board are empty, a microprocessor air baffle must be installed on microprocessor
1. This is applicable for all microprocessors.
Step 13. Reinstall the DIMM air baffle (see “Replacing the DIMM air baffle” on page 124).
Chapter 2
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Installing optional devices
97