Chapter 1: Introduction
Figure 1-5: S12E-G1133-2 Rear View
The enclosure rear section accommodates the following components:
•
RAID controller module(s):
The RAID controller module
manages all functionalities provided with the subsystem, and
all interface connectors are provided on the controller
faceplates. (See
Section 1.3.4
)
•
BBU module:
BBU modules come as standard equipment
for the redundant-controller R1132-4 model, and as an
optional module for the single-controller G1133-2. The BBU
sustains unfinished writes cached in memory during a power
outage in order to prevent data loss. (See
Section 1.3.6
)
•
PSU modules:
The hot-swappable PSUs receive single-
phase power and d5V, +12V, and +3.3V power to the
subsystem. A power switch is located on each PSU to turn
the system on and off. (See
Section 1.3.7
)
•
Cooling modules:
The redundant cooling modules ventilate
the subsystem to maintain a cooling airflow across the
subsystem. (See
Section 1.3.8
)
1.2.4 Backplane
Board
An internal backplane board separates the front and rear sections of
the enclosure. The backplane consists of traces for logic level signals
and low voltage power paths. It contains no user-serviceable
components.
WARNING!
When inserting a removable module,
DO NOT USE EXCESSIVE
FORCE
! Forcing or slamming a module can damage the pins on
the module connectors either on the module itself or on the
backplane. Gently push the module until it reaches the end of
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