IT3/IT5
Connector System
T
IPS FOR
SMT
A
SSEMBLY
Document Number:
ETAD-F0458
Revision 3.10
Page
59
of
73
11.5 Rework
Mos t BGA rework issues ha ve one of two root ca uses:
•
Solder pas te print quality
•
Reflow profile
Not a short
Actually,
Head-In-
Pillow
If the pins a re being detected as
voids during x-ra y inspection,
modi fy the inspection routine to
elimina te the false failure
HIP defects ma y be detected as
shorts , because the condi tion
forces the ball ’s image outside of
the normall y recognized ball area
of the x-ra y progra m. If images
a re captured tha t show offsets
similar to the one above, check for
head-in-pillow defect.
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
