IT3/IT5
Connector System
T
ABLE OF
C
ONTENTS
Document Number:
ETAD-F0458
Revision 3.10
Page
ii
7.9 Al te rna ti ve Alloys
35
7.10 Me tal Cap Re moval
35
8.0
Cleaning
37
8.1 Wa te r Washable Solde r Process
37
8.2 Saponi fie rs
38
8.3 No-Clean Solde r Process
38
8.4 Cleanliness Tes ting
39
9.0
Inspection
40
9.1 Sampling Frequency
40
9.2 X-Ra y La minography
40
9.3 Visual Inspe ction
40
9.4 X-Ra y Anal ysis and Voiding
41
9.5 Trans mission 2-Dimensional X-Ra y
41
9.6 Automa ti c Inspe ction Opti miza tion
42
10.0
Rework
43
10.1 Equipme nt and Supplies
43
10.2 Profiling
43
10.3 Reflow Profile Conside ra tions
44
10.4 Sugges ted The rmal Profiles
44
10.5 Spe cial Profiling Conside ra tions
45
10.6 Re cepta cle Removal
45
10.7 Site Redressing
46
10.8 Solde r Re plenishment
48
10.9 Re cepta cle Repla cement
48
10.10 Reflow Solde ring
49
10.11 Inspe cti on
49
10.12 Rework Solde r Paste Selection
49
11.0
Tips for SM T Assembly
51
11.1 Stencil Pri nting
51
11.2 Pi ck and Pla ce
55
11.3 Reflow
56
11.4 X-Ra y Inspe ction
58
11.5 Rework
59
12.0
System Level Assembly
62
12.1 Inte rpose r Ins tallation
62
12.2 Manual Assembl y
64
12.3 Ins tallation Ca p
65
12.4 Assembl y Fi xturing
66
13.0
System Level Disassembly
70
13.1 Daughte r ca rd removal
70
13.2 Inte rpose r Assembl y re moval
71
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
