IT3/IT5
Connector System
PWB
A
SSEMBLY
N
OTES
Document Number:
ETAD-F0458
Revision 3.10
Page
24
of
73
The Hirose
IT3/IT5
BGA Connector System is fully compatible with a wide range of SMT
equipment, and can be assembled on nearly any production line without requiring special
tooling or machinery. The connector receptacle’s printing and placement characteristics are
similar to 1.0mm BGA devices, and its low profile, open body design opens the reflow window.
It is available in tin-lead and lead-free configurations for IT3 and lead-free configurations for
IT5, with I/O counts ranging from 190 to 630.
The components of the system confirm to the packaging requirement of ISTA 3A (standard).
They are categorized in the MSL2A of IPC/JEDEC J-STD-020B, and are recommended to be used
within four weeks after being unpacked in the office environment defined by JEDEC.
Unless specifically mentioned, IT3 and IT5 share the same capability and requirement.
The Hirose IT3/IT5 BGA connector has print characteristics similar to 1.0mm BGA device. Its
pads are 0.6mm diameter on a staggered 1.5 x 1.75mm grid. It requires no special aperture
designs or stencil thicknesses, and can be successfully printed in any process that is capable of
printing 1.0mm BGA’s.
Unless specifically mentioned, IT3 and IT5 share the same capability and requirement.
5.1 Solder Paste Selection
The
IT3/IT5
connector receptacle is compatible with a broad range of solder pastes. It can
be used with
no-clean or water washable
products that include
Type 3
(particle size 25-45
microns)
or Type 4
(particle size 20-38 microns) powders. IT3 connectors are available in both
tin-lead and lead-free
configurations and IT5 connectors are available in
lead-free
configurations. The user should assure that the solder alloy used in the assembly process is
compatible with the appropriate component configuration.
Section 5 Stencil Printing
Section 4 Introduction to Assembly
IT3
Mating
Receptacle
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
