IT3/IT5
Connector System
D
ESIGN
N
OTES
Document Number:
ETAD-F0458
Revision 3.10
Page
14
of
73
PWB pad finish
is typi call y
Organic Solderability Preservative (OSP)
or
Hot Air Solder Level
(HASL)
, but the component can also be used with Electroless Nickel-Immersion Gold (ENIG),
Immersion Sil ver a nd Immersion Tin.
The
stencil apertures
should be
0.54mm circles
, concentri c wi th the copper pads . This
represents a 10% reduction from the diameter of the pad to compensate for typi cal va ria tions
in the assembl y process.
The specified clea rance, or
solder mask relief
, from the copper fea ture
is 0.05mm
.
Precauti on
: Verify fabricator capa bility. Solder mask registration
mus t be a ccura te to
a t least
0.05mm
. PWB fabri cator’s registra tion ca pability should be veri fied.
Depending on thickness of PWB, fabri ca tor’s
aspect ratio
capabili ties
for through
vias
should also be veri fied.
Mounting Receptacle –
IT3
M
Component Footprint and Contact Assignment
IT3
M-***S-BGA Footprint
* All dime nsions s hown are in mm.
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
