IT3/IT5
Connector System
G
ENERAL
I
NFORMATION
Document Number:
ETAD-F0458
Revision 3.10
Page
3
of
73
Hirose’s
IT3/IT5
connector system is designed to provide modular high-speed differential,
single-ended and power connections between two parallel boards. The interconnection to the
PWBs utilizes process-friendly Ball Grid Array receptacles, while the stacking height of 15 to
40mm for IT3 and 18 to 40mm for IT5 is set by an impedance-controlled interposer that is added
at the system level.
The
IT3/IT5
connector system consists of two receptacles and one interposer. The receptacles
have low profiles and open bodies. The BGA balls are mounted on compliant pins and are set on
a staggered grid of 1.5 and 1.75 mm pitch. Both the mating and mounting receptacles’
footprints are compatible with popular mezzanine connectors. Receptacles are available in tin-
lead and lead-free configurations for IT3 and lead-free for IT5. They can be used in no-clean or
water-wash assembly processes.
The interposer is an assembly consisting of individual wafers, each carrying 10 signal and 9
ground connections for IT3, and 10 signal and 11 ground connections for IT5. The interposer is
mounted to the receptacles and locked in with mechanical latches to create highly reliable and
stable mechanical and electrical connections. IT3 and IT5 interposers and receptacles are
interchangeable.
Section 2 General Information
Mating
receptacle
Interposer
assembly
Mating Side
Mounting
receptacle
Mounting Side
Interposer for IT5
Signal
Ground
Signal / Ground Conf iguration
Interposer for IT3
Signal
Ground
Signal / Ground Conf iguration
IT3D-***S-BGA(**)
IT3M-***S-BG A(**)
IT5*D-***S-BGA(**)
IT5*M-***S-BG A(**)
Polarity
Polarity
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
