IT3/IT5
Connector System
PWB
A
SSEMBLY
N
OTES
Document Number:
ETAD-F0458
Revision 3.10
Page
45
of
73
10.5 Special Profiling Considerations
Important profiling techniques for open-body package style:
1)
Place pick and place tape, polyimide disc, or metal cap on connector before profiling!
The open-body design of the connector aids in heat transfer, but the tape or cap used for
placing the receptacle will block some of the heat flow under the area where it is placed,
as shown below:
Joints under tape or cap get less airflow and stay cooler
The solder joints whose airflow is obscured by tape or cap will likely be the coolest on the
connector. Care should be taken during the profiling process to verify adequate thermal
exposure in these areas.
The tape or cap should not be peeled off the receptacle prior to
reflowing the solder joints.
2)
Component body should not be cooled during reflow heating
. Some convection rework
systems offer the option of component body cooling during the rework process. This
should
not
be used on the
IT3/IT5
connector. Its open body design allows good heat
transfer and low delta T’s between solder joints and component body.
Use of body
cooling system may
interfere with hot air flow and cause unnecessary temperature
differentials.
10.6 Receptacle Removal
Place polyimide disc or metal cap on center of connector where vacuum nozzle will pick up
component. Using profiles generated with these techniques, remove receptacle with rework
station.
Discard removed receptacle. Replace with new receptacle. Do not attempt to
reball and/or reuse receptacle.
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
