IT3/IT5
Connector System
PWB
A
SSEMBLY
N
OTES
Document Number:
ETAD-F0458
Revision 3.10
Page
32
of
73
The low profile design of the Hirose
IT3/IT5
connector receptacles has relatively low thermal
mass and provides open pathways to allow efficient heat transfer to the interconnections. The
package provides low temperature differentials between interior and exterior solder joints, and
between the interconnections and the package body. Because all standard receptacles are the
same height and mass, no special profiling considerations are required to accommodate
different stacking height requirements of the final assemblies. Lead-free BGA balls are SAC305
alloy.
Unless specifically mentioned, IT3 and IT5 share the same capability and requirement.
7.1 Instrumentation
The reflow process should be recorded using a digital data logger with thermocouples
attached to key locations on the PWB and connector.
7.2 Thermocouple Attachment
A
minimum of two thermocouples
should be used on the IT3/IT5 connector receptacle. One
should be located on an
inside ball
, preferably a ground connection (coolest solder joint), and
one on the
connector body
. A
third thermocouple
may be placed on an
outside ball,
preferably a signal connection (hottest solder joint).
Note:
It is
very important
to attach thermocouples to balls by drilling through PC
board and mounting from bottom side as shown below:
TC #1, Inside Ball
TC #2, Connector Body
TC #3, Outside Ball
Section 7 Reflow Processing
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
