IT3/IT5
Connector System
PWB
A
SSEMBLY
N
OTES
Document Number:
ETAD-F0458
Revision 3.10
Page
47
of
73
Solder Wicking Guidelines
If
solder wick
is the only available method of removing the excess solder, the operation should
be performed only by an experienced, certified rework specialist. A
fluxless braid
(wick)
should be used in conjunction with liquid flux. The braid should be
no more than 2-3 balls
wide
, and used with a blade-tip soldering iron.
Liquid flux must be used
in this process.
If the
solder braid contains flux, its compatibility with the liquid flux should be verified before the two
chemistries are used together.
Precautions:
Some
solder should remain on the pads
to help prevent exposure of
the intermetallic compound (IMC) layer to the atmosphere, which can allow it to
oxidize. An oxidized IMC layer is less solderable than a properly redressed pad and
could result in an open interconnection after the repair.
Inspection
After solder removal, the site should be thoroughly cleaned and dried before continuing. At
this time, the
pads and solder mask should be inspected
under a microscope
to ensure they
have not been damaged and are ready to receive a new component. It is very important to
check for solder mask damage between a pad and its corresponding via, as damage to the
solder mask dam can cause open or insufficient solder joints.
Bottom-Side Heaters
PCB
Bottom-side
Pin Support
Hot Gas
Nozzle
Vacuum
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