IT3/IT5
Connector System
PWB
A
SSEMBLY
N
OTES
Document Number:
ETAD-F0458
Revision 3.10
Page
31
of
73
6.7 Placement Force
Placement force should be adequate to firmly position component in solder paste without
grossly deforming deposits.
For best results, balls should be approximately ⅓ to ½ the depth
of the solder paste.
Consult placement equipment manufacturer for specific guidelines
regarding BGA mounting.
6.8 Orientation Indicator
The receptacle’s polarity is indicated by a chamfer on one corner, as shown below:
Mating
Receptacle
Mounting
Receptacle
Polarity chamfer
Polarity chamfer
IT3
D
– ***S - BGA (**)
IT3
M
– ***S-BGA (**)
IT3
M
-***S-BGA(**)
IT3
D
-***S-BGA(**)
Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved.